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Soldering in electronics assembly /

Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies....

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Judd, Mike
Otros Autores: Brindley, Keith
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Oxford ; New York : Newnes, 1992.
Temas:
Acceso en línea:Texto completo

MARC

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100 1 |a Judd, Mike. 
245 1 0 |a Soldering in electronics assembly /  |c Mike Judd and Keith Brindley. 
246 3 |a Electronics assembly 
260 |a Oxford ;  |a New York :  |b Newnes,  |c 1992. 
300 |a 1 online resource (xi, 286 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
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504 |a Includes bibliographical references (pages 233-238) and index. 
506 |3 Use copy  |f Restrictions unspecified  |2 star  |5 MiAaHDL 
533 |a Electronic reproduction.  |b [Place of publication not identified] :  |c HathiTrust Digital Library,  |d 2010.  |5 MiAaHDL 
538 |a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.  |u http://purl.oclc.org/DLF/benchrepro0212  |5 MiAaHDL 
583 1 |a digitized  |c 2010  |h HathiTrust Digital Library  |l committed to preserve  |2 pda  |5 MiAaHDL 
588 0 |a Print version record. 
505 0 |a Front Cover; Soldering in Electronics Assembly; Copyrights Page; Table of Contents; Preface; Acknowledgements; Chapter 1. Soldering process; Time on its side; Soldering; Soldering processes; Component/solder (CS) processes; Solder/component (SC) processes -- 'reflow' soldering; Cleaning; Quality; Safety; Chapter 2. Electronics assemblies; Joints; Through-hole joints; Surface mounted components; Surface mounted joints; Assembly variations; Assembly classification; Solder paste or adhesive application; Chapter 3. Solder; Metallurgical properties of tin/lead alloys; The soldered joint 
505 8 |a SolderabilityProtective coatings; Chapter 4. Flux; Need for flux; How fluxes work; Categorization of fluxes; Choosing a flux; Application of fluxes; Chapter 5. CS soldering processes; Hand soldering; Mass CS soldering processes; Inert atmosphere soldering; Handling assemblies; Solder pots and pumps; Solder pot heaters; Soldering; Chapter 6. SC soldering processes; Heat application; Infra-red soldering; Preheating; Temperature differentials; Profiles; Hot vapour soldering; Laser soldering; Light beam soldering; Heated collet or hot bar; Miscellaneous SC soldering processes 
505 8 |a Comparison of soldering processesChapter 7. Cleaning of soldered assemblies; The Montreal Protocol; Why clean at all?; Contamination; Classifications of cleaner; Cleaning processes; Contamination testing; Comparing the cleaning options; Chapter 8. Avoiding problems -- soldering quality; Have problems occurred?; Statistical process control; Solutions to problems; Chapter 9. Standards & specifications; Why comply with standards; Reference to standards; Levels of standards; Standards organizations and bodies; Standards for electronics assembly manufacture; Guide to relevant worldwide standards 
505 8 |a GlossaryReferences; Further reading; Specific books and articles; Trade publications and journals; Worldwide addresses; UK Governmental Departments; Institutions and associations; Standards organizations and bodies; Defence; Appendix 1: Why not blame the machine?; A guide for the misguided; Appendix 2: Problems & solutions; Appendix 3: Soldering safety; Appendix 4: Comparing soldering processes & machines; Wave soldering machine evaluation; Wave soldering machine evaluation; Index 
520 |a Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assem. 
546 |a English. 
650 0 |a Printed circuits  |x Design and construction. 
650 0 |a Solder and soldering. 
650 6 |a Soudure.  |0 (CaQQLa)201-0050584 
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650 7 |a Solder and soldering  |2 fast  |0 (OCoLC)fst01125221 
653 0 |a Electronic equipment  |a Components  |a Assembly 
700 1 |a Brindley, Keith. 
776 0 8 |i Print version:  |a Judd, Mike.  |t Soldering in electronics assembly.  |d Oxford ; New York : Newnes, 1992  |w (DLC) 94219704  |w (OCoLC)27172066 
856 4 0 |u https://sciencedirect.uam.elogim.com/science/book/9780750605892  |z Texto completo