Polymers for electronic and photonic applications /

The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This book provides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for m...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Wong, C. P., 1947-
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Boston : Academic Press, �1993.
Temas:
Electronics > Materials.
Photonics > Materials.
Polymers.
Polymers
�Electronique > Mat�eriaux.
Photonique > Mat�eriaux.
Polym�eres.
polymers.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronics > Materials
Photonics > Materials
Elektronik
Optoelektronischer Werkstoff
Photonik
Polymere
Werkstoff
Niet-lineaire optica.
Elektrische eigenschappen.
Elektronica.
Lithografie.
Polymeren.
Electronics > Use of > Polymers
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Front Cover; Polymers for Electronic and Photonic Applications; Copyright Page; Table of Contents; Contributors; Preface; Chapter 1.Overview of Polymers for Electronic and Photonic Applications; I. Introduction; II. Radiation-Sensitive Resists; III. Polymers for Packaging Applications; IV. Active Polymers; V. Conclusions; References; Chapter 2.The Chemistry of Polymers for Microlithographic Applications; I. Introduction; II. Resist Design Requirements; III. Negative Resist Chemistry; IV. Positive Resist Chemistry; V. Multilevel Resist Chemistry; VI. Gas-Phase Functionalization
  • VII. ConclusionReferences; Chapter 3.Interconnect Dielectrics; I. Introduction; II. Chemistry of Candidate Interconnect Dielectrics; III. Polymer Processing; IV. Electrical Properties; V. Mechanical Properties; VI. Chemical Properties; VII. Conclusions; Acknowledgments; References; Chapter 4.Recent Advances in IC Passivation and Encapsulation: Process Techniques and Materials; I. Introduction; II. Purpose of Encapsulation; III. Pre-encapsulation Cleaning; IV. Encapsulation Process Techniques; V. Device Encapsulants; VI. Recent Advances in Hermetically Equivalent IC Packaging; VII. Conclusions
  • Chapter 7.Application of Epoxy Resins in ElectronicsI. Introduction; II. Epoxy Resins; III. Curing Agents; IV. Summary; References; Chapter 8.Advances in Thermoplastics For Electronic Applications; I. Introduction; II. A Brief History of Plastics in Electronics; III. Emerging Trends in Electronics and Their Impact on Plastics; IV. Application Criteria for Plastics in Electronics; V. New Thermoplastics and Their Properties; VI. Emerging Electronic Applications of Thermoplastics; VII. Future Trends and Needs; References
  • Chapter 9.Polymers for Increased Circuit Density in Interconnection TechnologyI. Introduction; II. Multilayer Dielectrics; III. Material Design Strategy; IV. Structure Evaluation; V. Strategy Summary; References; Chapter 10.Piezoelectric and Pyroelectric Polymers; I. Introduction; II. Polarization in Polymers; III. Pyroelectric Coefficients; IV. Piezoelectric Coefficients; V. Specific Polymers; VI. Conclusion; References; Chapter 11. Polymers for Nonlinear Optics; I. Introduction; II. Applications Requirements; III. Polymers for x(2) Applications

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