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100702s1993 maua ob 001 0 eng d |
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|a OCLCE
|b eng
|e pn
|c OCLCE
|d OCLCQ
|d UIU
|d OCLCF
|d OPELS
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|a 300576082
|a 899001685
|a 1162245842
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|a 9781483289397
|q (electronic bk.)
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|a 1483289397
|q (electronic bk.)
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|z 0127625402
|q (acid-free paper)
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|z 9780127625409
|q (acid-free paper)
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|a (OCoLC)645858247
|z (OCoLC)300576082
|z (OCoLC)899001685
|z (OCoLC)1162245842
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|a dlr
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|a TK7871.15.P6
|b P6 1993
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|a TEC
|x 009070
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|a VE 9580
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|a ZN 3470
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|a Polymers for electronic and photonic applications /
|c edited by C.P. Wong.
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260 |
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|a Boston :
|b Academic Press,
|c �1993.
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300 |
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|a 1 online resource (xiv, 661 pages) :
|b illustrations
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a Includes bibliographical references and index.
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|a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.
|u http://purl.oclc.org/DLF/benchrepro0212
|5 MiAaHDL
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583 |
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|a digitized
|c 2010
|h HathiTrust Digital Library
|l committed to preserve
|2 pda
|5 MiAaHDL
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|a Print version record.
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|a The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This book provides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging, electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacture microelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments in this field.
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|a Front Cover; Polymers for Electronic and Photonic Applications; Copyright Page; Table of Contents; Contributors; Preface; Chapter 1.Overview of Polymers for Electronic and Photonic Applications; I. Introduction; II. Radiation-Sensitive Resists; III. Polymers for Packaging Applications; IV. Active Polymers; V. Conclusions; References; Chapter 2.The Chemistry of Polymers for Microlithographic Applications; I. Introduction; II. Resist Design Requirements; III. Negative Resist Chemistry; IV. Positive Resist Chemistry; V. Multilevel Resist Chemistry; VI. Gas-Phase Functionalization
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|a VII. ConclusionReferences; Chapter 3.Interconnect Dielectrics; I. Introduction; II. Chemistry of Candidate Interconnect Dielectrics; III. Polymer Processing; IV. Electrical Properties; V. Mechanical Properties; VI. Chemical Properties; VII. Conclusions; Acknowledgments; References; Chapter 4.Recent Advances in IC Passivation and Encapsulation: Process Techniques and Materials; I. Introduction; II. Purpose of Encapsulation; III. Pre-encapsulation Cleaning; IV. Encapsulation Process Techniques; V. Device Encapsulants; VI. Recent Advances in Hermetically Equivalent IC Packaging; VII. Conclusions
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|a Chapter 7.Application of Epoxy Resins in ElectronicsI. Introduction; II. Epoxy Resins; III. Curing Agents; IV. Summary; References; Chapter 8.Advances in Thermoplastics For Electronic Applications; I. Introduction; II. A Brief History of Plastics in Electronics; III. Emerging Trends in Electronics and Their Impact on Plastics; IV. Application Criteria for Plastics in Electronics; V. New Thermoplastics and Their Properties; VI. Emerging Electronic Applications of Thermoplastics; VII. Future Trends and Needs; References
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|a Chapter 9.Polymers for Increased Circuit Density in Interconnection TechnologyI. Introduction; II. Multilayer Dielectrics; III. Material Design Strategy; IV. Structure Evaluation; V. Strategy Summary; References; Chapter 10.Piezoelectric and Pyroelectric Polymers; I. Introduction; II. Polarization in Polymers; III. Pyroelectric Coefficients; IV. Piezoelectric Coefficients; V. Specific Polymers; VI. Conclusion; References; Chapter 11. Polymers for Nonlinear Optics; I. Introduction; II. Applications Requirements; III. Polymers for x(2) Applications
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546 |
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|a English.
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650 |
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|a Electronics
|x Materials.
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650 |
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|a Photonics
|x Materials.
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|a Polymers.
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2 |
|a Polymers
|0 (DNLM)D011108
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6 |
|a �Electronique
|x Mat�eriaux.
|0 (CaQQLa)201-0016374
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650 |
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6 |
|a Photonique
|0 (CaQQLa)201-0012485
|x Mat�eriaux.
|0 (CaQQLa)201-0379329
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650 |
|
6 |
|a Polym�eres.
|0 (CaQQLa)201-0000257
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650 |
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7 |
|a polymers.
|2 aat
|0 (CStmoGRI)aat300218300
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|a TECHNOLOGY & ENGINEERING
|x Mechanical.
|2 bisacsh
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650 |
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|a Electronics
|x Materials
|2 fast
|0 (OCoLC)fst00907562
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650 |
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|a Photonics
|x Materials
|2 fast
|0 (OCoLC)fst01062075
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|a Polymers
|2 fast
|0 (OCoLC)fst01070588
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|a Elektronik
|2 gnd
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|a Optoelektronischer Werkstoff
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|a Photonik
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|a Polymere
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|a Werkstoff
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|a Niet-lineaire optica.
|2 gtt
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|a Elektrische eigenschappen.
|2 gtt
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|a Elektronica.
|2 gtt
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|a Lithografie.
|2 gtt
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|a Polymeren.
|2 gtt
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|a Electronics
|a Use of
|a Polymers
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|a Wong, C. P.,
|d 1947-
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776 |
0 |
8 |
|i Print version:
|t Polymers for electronic and photonic applications.
|d Boston : Academic Press, �1993
|w (DLC) 92010971
|w (OCoLC)25748567
|
856 |
4 |
0 |
|u https://sciencedirect.uam.elogim.com/science/book/9780127625409
|z Texto completo
|