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Encapsulation technologies for electronic applications /
Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contaminatio...
| Clasificación: | Libro Electrónico |
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| Autor principal: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Burlington, MA :
William Andrew,
2009.
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| Colección: | Materials and processes for electronic applications series.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Front Cover; Encapsulation Technologies for Electronic Applications; Copyright Page; Contents; Preface; Chapter 1 Introduction; 1.1 Historical Overview; 1.2 Electronic Packaging; 1.3 Encapsulated Microelectronic Packages; 1.4 Hermetic Packages; 1.5 Encapsulants; 1.6 Plastic versus Hermetic Packages; 1.7 Summary; References; Chapter 2 Plastic Encapsulant Materials; 2.1 Chemistry Overview; 2.2 Molding Compounds; 2.3 Glob-Top Encapsulants; 2.4 Potting and Casting Encapsulants; 2.5 Underfill Encapsulants; 2.6 Printing Encapsulants; 2.7 Environmentally Friendly or "Green" Encapsulants; 2.8 Summary
- 5.1 Overview of Package Defects and Failures5.2 Encapsulation Defects; 5.3 Encapsulation Failures; 5.4 Failure Accelerators; 5.5 Summary; References; Chapter 6 Defect and Failure Analysis Techniques for Encapsulated Microelectronics; 6.1 General Defect and Failure Analysis Procedures; 6.2 Optical Microscopy; 6.3 Scanning Acoustic Microscopy; 6.4 X-ray Microscopy; 6.5 X-ray Fluorescence Spectroscopy; 6.6 Electron Microscopy; 6.7 Atomic Force Microscopy; 6.8 Infrared Microscopy; 6.9 Selection of Failure Analysis Techniques; 6.10 Summary; References; Chapter 7 Qualification and Quality Assurance
- 7.1 A Brief History of Qualification and Reliability Assessment7.2 Qualification Process Overview; 7.3 Virtual Qualification; 7.4 Product Qualification; 7.5 Qualification Accelerated Tests; 7.6 Industry Practices; 7.7 Quality Assurance; 7.8 Summary; References; Chapter 8 Trends and Challenges; 8.1 Microelectronic Device Structure and Packaging; 8.2 Extreme High- and Low-Temperature Electronics; 8.3 Emerging Technologies; 8.4 Summary; References; Index