Microjoining and nanojoining /

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Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufactu...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: Institute of Materials, Minerals, and Mining
Otros Autores: Zhou, Y.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cambridge, England : Boca Raton : Woodhead Pub. and Maney Pub., on behalf of the Institute of Materials, Minerals & Mining ; CRC Press, 2008.
Colección:Woodhead Publishing in materials.
Temas:
Microelectromechanical systems > Design and construction.
Nanoelectromechanical systems > Design and construction.
Microtechnology.
Nanotechnology.
Joints (Engineering)
Sealing (Technology)
Metal bonding.
Microelectronics.
Nanoelectronics.
Miniaturization
Nanotechnology
Microtechnologie.
Assemblages (Technologie)
�Etanch�eit�e.
M�etaux > Collage.
Micro�electronique.
Nano�electronique.
Nanotechnologie.
joints (connections)
microelectronics.
sealing (process)
TECHNOLOGY & ENGINEERING > Technical & Manufacturing Industries & Trades.
Metal bonding
Microelectromechanical systems > Design and construction
Microelectronics
Microtechnology
Nanoelectronics
Festk�orper
Mikroelektronik
Nanoelektronik
Nanostrukturiertes Material
Verbindungstechnik
Aufsatzsammlung.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Introduction
  • Basics of microjoining: Mechanisms of solid-state bonding processes / J.E. Gould. Mechanisms of soldering and brazing / T. Takemoto. Fundamentals of fusion microwelding / G.A. Knorovsky. Modeling of solid state bonding / Y. Takahashi. Modeling of fusion microwelding / B.H. Chang. Sensing, monitoring and control / M. Mayer. Assembly process automation and materials handling / Y.M. Cheung, D. Liu
  • Microjoining and nanojoining processes: Microelectronics wire bonding / I. Lum, M. Mayer, Y. Zhou. Solid-state diffusion bonding / A. Shirzadi. Bonding using nanoparticles / A. Hirose. Diffusion soldering and brazing / M.L. Kuntz, Y. Zhou
  • Laser Soldering / Y.H. Tian, C.Q. Wang
  • Fluxless soldering / J.P. Jung
  • Laser microwelding / I. Mityamoto. Electron beam microwelding / G.A. Knorovsky. Resistance microwelding / S. Fukumoto. Adhesive bonding / S. Bohm, G. Hemken, M. Wagner. Introduction to nanojoining / S. Sahin
  • Microjoining of materials and applications of microjoining: Joining of high temperature superconductors / G. Zou. Joining of shape memory alloys / K. Uenishi, K.F. Kobayashi. Wafer bonding / J. Wei, Z. Sun. Plastics microwelding / I. Jones. Microjoining in medical components and devices / K.J. Ely, Y. Zhou. Hermetic sealing of solid oxide fuel cells / M. Brochu. Joining of bulk nanostructured materials / M. Brochu. Ceramic/metal bonding / A Wu.

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