Adhesives technology for electronic applications : materials, processes, reliability /

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This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new develo...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Licari, James J., 1930-
Otros Autores: Swanson, Dale W.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Norwich, NY : William Andrew Pub., �2005.
Colección:Materials and processes for electronic applications series.
Temas:
Electronics > Materials.
Adhesives.
Electronic packaging.
Adhesives
�Electronique > Mat�eriaux.
Adh�esifs.
Mise sous bo�itier (�Electronique)
adhesive.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Handbooks
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Introduction
  • Functions and Theory of Adhesives
  • Chemistry, Formulation, and Properties of Adhesives
  • Adhesive Bonding Properties
  • Applications
  • Reliability
  • Test and Inspection Methods
  • Appendix
  • Conversion Factors
  • Abbreviations and Acronyms
  • Index.

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