Cargando…
Adhesives technology for electronic applications : materials, processes, reliability /
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new develo...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Norwich, NY :
William Andrew Pub.,
�2005.
|
| Colección: | Materials and processes for electronic applications series.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a22000004a 4500 | ||
|---|---|---|---|
| 001 | SCIDIR_ocn468750627 | ||
| 003 | OCoLC | ||
| 005 | 20231117015147.0 | ||
| 006 | m o d | ||
| 007 | cr |n||||||||| | ||
| 008 | 050502s2005 nyua ob 001 0 eng c | ||
| 010 | |a 2005012647 | ||
| 040 | |a COO |b eng |e pn |c COO |d KNOVL |d DEBSZ |d BUF |d BAKER |d UBY |d E7B |d OCLCQ |d DEBBG |d OCLCQ |d KNOVL |d OCLCF |d OCLCO |d OPELS |d B24X7 |d ZCU |d KNOVL |d YDXCP |d AU@ |d N$T |d IDEBK |d OCLCQ |d VT2 |d UAB |d REB |d D6H |d OCLCQ |d CEF |d RRP |d COO |d WYU |d YOU |d LEAUB |d OCLCO |d OCLCQ | ||
| 016 | |a 000027082070 |2 AU | ||
| 019 | |a 64573474 |a 69241972 |a 224377329 |a 281598690 |a 310009759 |a 505070401 |a 647802797 |a 961887431 |a 988679233 |a 999408694 |a 1026443076 |a 1058058799 |a 1065662276 |a 1087309865 | ||
| 020 | |a 0815515138 | ||
| 020 | |a 9780815515135 | ||
| 020 | |a 1591249422 |q (electronic bk.) | ||
| 020 | |a 9781591249429 |q (electronic bk.) | ||
| 020 | |a 9780080947167 |q (e-book) | ||
| 020 | |a 0080947166 |q (e-book) | ||
| 020 | |a 9780815516002 |q (electronic bk.) | ||
| 020 | |a 0815516002 |q (electronic bk.) | ||
| 024 | 8 | |a 2240562 | |
| 035 | |a (OCoLC)468750627 |z (OCoLC)64573474 |z (OCoLC)69241972 |z (OCoLC)224377329 |z (OCoLC)281598690 |z (OCoLC)310009759 |z (OCoLC)505070401 |z (OCoLC)647802797 |z (OCoLC)961887431 |z (OCoLC)988679233 |z (OCoLC)999408694 |z (OCoLC)1026443076 |z (OCoLC)1058058799 |z (OCoLC)1065662276 |z (OCoLC)1087309865 | ||
| 042 | |a pcc | ||
| 050 | 4 | |a TK7871 |b .L53 2005 | |
| 072 | 7 | |a TEC |x 008070 |2 bisacsh | |
| 072 | 7 | |a TEC |x 008060 |2 bisacsh | |
| 082 | 0 | 4 | |a 621.381 |2 22 |
| 100 | 1 | |a Licari, James J., |d 1930- | |
| 245 | 1 | 0 | |a Adhesives technology for electronic applications : |b materials, processes, reliability / |c by James J. Licari and Dale W. Swanson. |
| 260 | |a Norwich, NY : |b William Andrew Pub., |c �2005. | ||
| 300 | |a 1 online resource (xvi, 459 pages) : |b illustrations. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Materials and processes for electronic applications series | |
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Introduction -- Functions and Theory of Adhesives -- Chemistry, Formulation, and Properties of Adhesives -- Adhesive Bonding Properties -- Applications -- Reliability -- Test and Inspection Methods -- Appendix -- Conversion Factors -- Abbreviations and Acronyms -- Index. | |
| 520 | |a This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references. | ||
| 650 | 0 | |a Electronics |x Materials. | |
| 650 | 0 | |a Adhesives. | |
| 650 | 0 | |a Electronic packaging. | |
| 650 | 2 | |a Adhesives |0 (DNLM)D000269 | |
| 650 | 6 | |a �Electronique |x Mat�eriaux. |0 (CaQQLa)201-0016374 | |
| 650 | 6 | |a Adh�esifs. |0 (CaQQLa)201-0015429 | |
| 650 | 6 | |a Mise sous bo�itier (�Electronique) |0 (CaQQLa)201-0074280 | |
| 650 | 7 | |a adhesive. |2 aat |0 (CStmoGRI)aat300014801 | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Microelectronics. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Digital. |2 bisacsh | |
| 650 | 7 | |a Adhesives. |2 fast |0 (OCoLC)fst00796614 | |
| 650 | 7 | |a Electronic packaging. |2 fast |0 (OCoLC)fst00907414 | |
| 650 | 7 | |a Electronics |x Materials. |2 fast |0 (OCoLC)fst00907562 | |
| 653 | |a Handbooks | ||
| 700 | 1 | |a Swanson, Dale W. | |
| 776 | 0 | 8 | |i Print version: |a Licari, James J., 1930- |t Adhesives technology for electronic applications. |d Norwich, NY : William Andrew Pub., �2005 |z 0815515138 |w (DLC) 2005012647 |w (OCoLC)60321722 |
| 830 | 0 | |a Materials and processes for electronic applications series. | |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/book/9780815515135 |z Texto completo |