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Adhesives technology for electronic applications : materials, processes, reliability /
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new develo...
| Clasificación: | Libro Electrónico |
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| Autor principal: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Norwich, NY :
William Andrew Pub.,
�2005.
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| Colección: | Materials and processes for electronic applications series.
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| Temas: | |
| Acceso en línea: | Texto completo |
| Sumario: | This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references. |
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| Descripción Física: | 1 online resource (xvi, 459 pages) : illustrations. |
| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 0815515138 9780815515135 1591249422 9781591249429 9780080947167 0080947166 9780815516002 0815516002 |