Cargando…

Temperature-fatigue interaction /

This volume contains a selection of peer-reviewed papers presented at the International Conference on Temperature-Fatigue Interaction, held in Paris, May 29-31, 2001, organised by the Fatigue Committee of the Socie�t Fra�naise de �Mtallurgie et de Ma�triau...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: International Conference on Temperature-Fatigue Interaction Paris, France
Otros Autores: R�emy, L., Petit, J. (Jean)
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Amsterdam ; New York : Elsevier, 2002.
Edición:1st ed.
Colección:ESIS publication ; 29.
Temas:
Acceso en línea:Texto completo
Texto completo

MARC

LEADER 00000cam a2200000 a 4500
001 SCIDIR_ocn162566941
003 OCoLC
005 20231117014914.0
006 m o d
007 cr cn|||||||||
008 070806s2002 ne a ob 101 0 eng d
040 |a OPELS  |b eng  |e pn  |c OPELS  |d OCLCG  |d OCLCQ  |d OPELS  |d OCLCQ  |d N$T  |d YDXCP  |d MERUC  |d IDEBK  |d OCLCQ  |d OCLCE  |d OCLCO  |d OCLCF  |d OCL  |d OCLCO  |d OCLCQ  |d EBLCP  |d OCLCQ  |d DEBSZ  |d OCLCQ  |d D6H  |d OCLCQ  |d ADU  |d S2H  |d OCLCO  |d OCLCQ  |d OCLCO  |d COM  |d OCLCQ 
019 |a 173240371  |a 174040050  |a 441797526  |a 606840747  |a 1160086071 
020 |a 9780080439822 
020 |a 0080439829 
020 |a 9780080542324  |q (electronic bk.) 
020 |a 0080542328  |q (electronic bk.) 
035 |a (OCoLC)162566941  |z (OCoLC)173240371  |z (OCoLC)174040050  |z (OCoLC)441797526  |z (OCoLC)606840747  |z (OCoLC)1160086071 
042 |a dlr 
050 4 |a TA417.7.H55  |b I58 2001eb 
072 7 |a TA  |2 lcco 
072 7 |a SCI  |x 050000  |2 bisacsh 
082 0 4 |a 620.1/1217  |2 22 
111 2 |a International Conference on Temperature-Fatigue Interaction  |n (9th :  |d 2001 :  |c Paris, France) 
245 1 0 |a Temperature-fatigue interaction /  |c editors, L. R�emy and J. Petit ; SF2M. 
250 |a 1st ed. 
260 |a Amsterdam ;  |a New York :  |b Elsevier,  |c 2002. 
300 |a 1 online resource (xii, 384 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a ESIS publication,  |x 1566-1369 ;  |v 29 
520 |a This volume contains a selection of peer-reviewed papers presented at the International Conference on Temperature-Fatigue Interaction, held in Paris, May 29-31, 2001, organised by the Fatigue Committee of the Socie�t Fra�naise de �Mtallurgie et de Ma�triaux (SF2M), under the auspices of the European Structural Integrity Society. The conference disseminated recent research results and promoting the interaction and collaboration amongst materials scientists, mechanical engineers and design engineers. Many engineering components and structures used in the automotive, aerospace, power generation and many other industries experience cyclic mechanical loads at high temperature or temperature transients causing thermally induced stresses. The increase of operating temperature and thermal mechanical loading trigger the interaction with time-dependent phenomena such as creep and environmental effects (oxidation, corrosion). A large number of metallic materials were investigated including aluminium alloys for the automotive industry, steels and cast iron for the automotive industry and materials forming, stainless steels for power plants, titanium, composites, intermetallic alloys and nickel base superalloys for aircraft industry, polymers. Important progress was observed in testing practice for high temperature behaviour, including environment and thermo-mechanical loading as well as in observation techniques. A large problem which was emphasized is to know precisely service loading cycles under non-isothermal conditions. This was considered critical for numerous thermal fatigue problems discussed in this conference. 
505 0 |a Chapter headings. Thermomechancial behaviour. Damage under isothermal loading. Damage under thermal-mechanical loading. Crack growth. Design and structures. 
500 |a "This volume contains 37 papers, peer-reviewed from those presented at the International Conference on Temperature-Fatigue Interaction, ninth international spring meeting organised by the Fatigue Committee of SF2M, held in Paris, France, 29-31 May 2001." 
504 |a Includes bibliographical references and index. 
588 0 |a Print version record. 
506 |3 Use copy  |f Restrictions unspecified  |2 star  |5 MiAaHDL 
533 |a Electronic reproduction.  |b [Place of publication not identified] :  |c HathiTrust Digital Library,  |d 2010.  |5 MiAaHDL 
538 |a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002.  |u http://purl.oclc.org/DLF/benchrepro0212  |5 MiAaHDL 
583 1 |a digitized  |c 2010  |h HathiTrust Digital Library  |l committed to preserve  |2 pda  |5 MiAaHDL 
650 0 |a Materials at high temperatures  |v Congresses. 
650 0 |a Materials  |x Fatigue  |v Congresses. 
650 6 |a Mat�eriaux �a hautes temp�eratures  |0 (CaQQLa)201-0024119  |v Congr�es.  |0 (CaQQLa)201-0378219 
650 6 |a Mat�eriaux  |0 (CaQQLa)201-0029332  |x Fatigue  |0 (CaQQLa)201-0029332  |v Congr�es.  |0 (CaQQLa)201-0378219 
650 7 |a SCIENCE  |x Nanoscience.  |2 bisacsh 
650 7 |a Materials at high temperatures.  |2 fast  |0 (OCoLC)fst01011904 
650 7 |a Materials  |x Fatigue.  |2 fast  |0 (OCoLC)fst01011834 
655 2 |a Congress  |0 (DNLM)D016423 
655 7 |a Conference papers and proceedings.  |2 fast  |0 (OCoLC)fst01423772 
655 7 |a Conference papers and proceedings.  |2 lcgft 
655 7 |a Actes de congr�es.  |2 rvmgf  |0 (CaQQLa)RVMGF-000001049 
700 1 |a R�emy, L. 
700 1 |a Petit, J.  |q (Jean) 
776 0 8 |i Print version:  |a International Conference on Temperature-Fatigue Interaction (9th : 2001 : Paris, France).  |t Temperature-fatigue interaction.  |b 1st ed.  |d Amsterdam ; New York : Elsevier, 2002  |z 0080439829  |z 9780080439822  |w (DLC) 2002283002  |w (OCoLC)50591176 
830 0 |a ESIS publication ;  |v 29.  |x 1566-1369 
856 4 0 |u https://sciencedirect.uam.elogim.com/science/book/9780080439822  |z Texto completo 
856 4 0 |u https://sciencedirect.uam.elogim.com/science/bookseries/15661369/29  |z Texto completo