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Thin film materials technology : sputtering of compound materials /

An invaluable resource for industrial science and engineering newcomers to sputter deposition technology in thin film production applications, this book is rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, a key techn...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Wasa, Kiyotaka
Otros Autores: Kitabatake, Makoto, Adachi, Hideaki
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Norwich, NY : Heidelberg : William Andrew Pub. ; Springer, �2004.
Temas:
Acceso en línea:Texto completo

MARC

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100 1 |a Wasa, Kiyotaka. 
245 1 0 |a Thin film materials technology :  |b sputtering of compound materials /  |c by Kiyotaka Wasa, Makoto Kitabatake, Hideaki Adachi. 
260 |a Norwich, NY :  |b William Andrew Pub. ;  |a Heidelberg :  |b Springer,  |c �2004. 
300 |a 1 online resource (xiv, 518 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
588 0 |a Print version record. 
505 0 |a Thin Film Materials and Devices -- Thin Film Process -- Sputtering Phenomena -- Sputtering Systems -- Deposition of Compound Thin Films -- Structural Control of Compound Thin Films -- Microfabrication by Sputtering -- Appendices -- Index. 
520 |a An invaluable resource for industrial science and engineering newcomers to sputter deposition technology in thin film production applications, this book is rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, a key technology for nano-materials in high-speed information applications and large-area functional coating such as automotive or decorative painting of plastic parts, among other topics. In seven concise chapters, the book thoroughly reviews basic thin film technology and deposition processes, sputtering processes, structural control of compound thin films, and microfabrication by sputtering. 
546 |a English. 
650 0 |a Cathode sputtering (Plating process) 
650 0 |a Thin films. 
650 6 |a Pulv�erisation cathodique  |x Applications industrielles.  |0 (CaQQLa)201-0180809 
650 6 |a Couches minces.  |0 (CaQQLa)201-0035883 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Solid State.  |2 bisacsh 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Semiconductors.  |2 bisacsh 
650 7 |a Cathode sputtering (Plating process)  |2 fast  |0 (OCoLC)fst00849113 
650 7 |a Thin films.  |2 fast  |0 (OCoLC)fst01150018 
700 1 |a Kitabatake, Makoto. 
700 1 |a Adachi, Hideaki. 
776 0 8 |i Print version:  |a Wasa, Kiyotaka.  |t Thin film materials technology.  |d Norwich, NY : William Andrew Pub. ; Heidelberg : Springer, �2004  |z 0815514832  |w (DLC) 2003018016  |w (OCoLC)52886812 
856 4 0 |u https://sciencedirect.uam.elogim.com/science/book/9780815514831  |z Texto completo