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Tribology of abrasive machining processes /
Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundame...
| Clasificación: | Libro Electrónico |
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| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Norwich, NY :
William Andrew Pub.,
�2004.
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| Temas: | |
| Acceso en línea: | Texto completo |
| Sumario: | Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors. |
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| Descripción Física: | 1 online resource (xxvii, 724 pages) : illustrations |
| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 0815514905 9780815514909 9780815519386 0815519389 9786612769580 6612769580 1282769588 9781282769588 0080947026 9780080947020 1282027697 9781282027695 9786612027697 661202769X |
| Acceso: | Access restricted to Ryerson students, faculty and staff. |