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Hybrid microcircuit technology handbook : materials, processes, design, testing and production /

Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Licari, James J., 1930-
Otros Autores: Enlow, Leonard R.
Formato: eBook
Idioma:Inglés
Publicado: Westwood, N.J. : Noyes Publicatons, �1998.
Edición:2nd ed.
Colección:Materials science and process technology series.
Temas:
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Introduction
  • Substrates
  • Thin Film Processes
  • Thick Film Processes
  • Resistor Trimming
  • Parts Selection
  • Assembly Processes
  • Testing
  • Handling and Clean Rooms
  • Design Guidelines
  • Documentation and Specifications
  • Failure Analysis
  • Multichip Modules: A New Breed of Hybrid Microcircuits
  • References
  • Index.