Hybrid microcircuit technology handbook : materials, processes, design, testing and production /
Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...
Clasificación: | Libro Electrónico |
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Autor principal: | |
Otros Autores: | |
Formato: | eBook |
Idioma: | Inglés |
Publicado: |
Westwood, N.J. :
Noyes Publicatons,
�1998.
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Edición: | 2nd ed. |
Colección: | Materials science and process technology series.
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Temas: | |
Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Introduction
- Substrates
- Thin Film Processes
- Thick Film Processes
- Resistor Trimming
- Parts Selection
- Assembly Processes
- Testing
- Handling and Clean Rooms
- Design Guidelines
- Documentation and Specifications
- Failure Analysis
- Multichip Modules: A New Breed of Hybrid Microcircuits
- References
- Index.