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Hybrid microcircuit technology handbook : materials, processes, design, testing and production /
Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Otros Autores: | |
| Formato: | eBook |
| Idioma: | Inglés |
| Publicado: |
Westwood, N.J. :
Noyes Publicatons,
�1998.
|
| Edición: | 2nd ed. |
| Colección: | Materials science and process technology series.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 082 | 0 | 4 | |a 621.3815 |2 22 |
| 100 | 1 | |a Licari, James J., |d 1930- | |
| 245 | 1 | 0 | |a Hybrid microcircuit technology handbook : |b materials, processes, design, testing and production / |c by James J. Licari and Leonard R. Enlow. |
| 250 | |a 2nd ed. | ||
| 260 | |a Westwood, N.J. : |b Noyes Publicatons, |c �1998. | ||
| 300 | |a 1 online resource (xxi, 579 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a computer disc |b cd |2 rdacarrier | ||
| 490 | 1 | |a Materials science and process technology series | |
| 520 | |a Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a Introduction -- Substrates -- Thin Film Processes -- Thick Film Processes -- Resistor Trimming -- Parts Selection -- Assembly Processes -- Testing -- Handling and Clean Rooms -- Design Guidelines -- Documentation and Specifications -- Failure Analysis -- Multichip Modules: A New Breed of Hybrid Microcircuits -- References -- Index. | |
| 506 | |3 Use copy |f Restrictions unspecified |2 star |5 MiAaHDL | ||
| 533 | |a Electronic reproduction. |b [Place of publication not identified] : |c HathiTrust Digital Library, |d 2010. |5 MiAaHDL | ||
| 538 | |a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. |u http://purl.oclc.org/DLF/benchrepro0212 |5 MiAaHDL | ||
| 583 | 1 | |a digitized |c 2010 |h HathiTrust Digital Library |l committed to preserve |2 pda |5 MiAaHDL | |
| 546 | |a English. | ||
| 650 | 0 | |a Hybrid integrated circuits |x Design and construction |v Handbooks, manuals, etc. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Circuits |x Integrated. |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Circuits |x General. |2 bisacsh | |
| 650 | 7 | |a Hybrid integrated circuits |x Design and construction. |2 fast |0 (OCoLC)fst00964518 | |
| 655 | 2 | |a Handbook |0 (DNLM)D020479 | |
| 655 | 7 | |a Handbooks and manuals. |2 fast |0 (OCoLC)fst01423877 | |
| 655 | 7 | |a Handbooks and manuals. |2 lcgft | |
| 655 | 7 | |a Guides et manuels. |2 rvmgf |0 (CaQQLa)RVMGF-000001065 | |
| 700 | 1 | |a Enlow, Leonard R. | |
| 776 | 0 | 8 | |i Print version: |a Licari, James J., 1930- |t Hybrid microcircuit technology handbook. |b 2nd ed. |d Westwood, N.J. : Noyes Publicatons, �1998 |z 0815514239 |w (DLC) 98006322 |w (OCoLC)38573122 |
| 830 | 0 | |a Materials science and process technology series. | |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/book/9780815514237 |z Texto completo |