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Electronic packaging science and technology /
"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic pa...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Hoboken, NJ :
John Wiley & Sons, Inc.,
2022.
|
| Temas: | |
| Acceso en línea: | Texto completo (Requiere registro previo con correo institucional) |
MARC
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
| 001 | OR_on1268544247 | ||
| 003 | OCoLC | ||
| 005 | 20231017213018.0 | ||
| 006 | m o d | ||
| 007 | cr cnu---unuuu | ||
| 008 | 210916t20222022nju ob 001 0 eng | ||
| 010 | |a 2021039115 | ||
| 040 | |a DLC |b eng |e rda |c DLC |d OCLCO |d DG1 |d OCLCO |d OCLCF |d OCLCO |d YDX |d OCLCQ |d UPM |d OCLCQ |d ORMDA |d LANGC |d OCLCQ |d OCLCO | ||
| 020 | |a 9781119418344 |q electronic book | ||
| 020 | |a 1119418348 |q electronic book | ||
| 020 | |a 9781119418337 |q electronic book | ||
| 020 | |a 111941833X |q electronic book | ||
| 020 | |a 9781119418320 |q electronic book | ||
| 020 | |a 1119418321 |q electronic book | ||
| 020 | |z 9781119418313 |q hardcover | ||
| 024 | 7 | |a 10.1002/9781119418344 |2 doi | |
| 029 | 1 | |a AU@ |b 000069923991 | |
| 035 | |a (OCoLC)1268544247 | ||
| 037 | |a 9781119418313 |b O'Reilly Media | ||
| 042 | |a pcc | ||
| 050 | 0 | 0 | |a TK7870.15 |b .T85 2022 |
| 082 | 0 | 0 | |a 621.381/046 |2 23 |
| 049 | |a UAMI | ||
| 100 | 1 | |a Tu, K. N. |q (King-Ning), |d 1937- |e author. | |
| 245 | 1 | 0 | |a Electronic packaging science and technology / |c King-Ning Tu, Chih Chen, Hung-Ming Chen. |
| 264 | 1 | |a Hoboken, NJ : |b John Wiley & Sons, Inc., |c 2022. | |
| 264 | 4 | |c ©2022 | |
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index. | ||
| 520 | |a "This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"-- |c Provided by publisher. | ||
| 588 | |a Description based on online resource; title from digital title page (viewed on April 14, 2022). | ||
| 590 | |a O'Reilly |b O'Reilly Online Learning: Academic/Public Library Edition | ||
| 650 | 0 | |a Electronic packaging. | |
| 650 | 6 | |a Mise sous boîtier (Électronique) | |
| 650 | 7 | |a Electronic packaging |2 fast | |
| 700 | 1 | |a Chen, Chih, |d 1970- |e author. | |
| 700 | 1 | |a Chen, Hung-Ming, |e author. | |
| 776 | 0 | 8 | |i Print version: |a Tu, K. N. 1937- |t Electronic packaging science and technology |b 1st edition. |d Hoboken, NJ : Wiley, 2022 |z 9781119418313 |w (DLC) 2021039114 |
| 856 | 4 | 0 | |u https://learning.oreilly.com/library/view/~/9781119418313/?ar |z Texto completo (Requiere registro previo con correo institucional) |
| 994 | |a 92 |b IZTAP | ||