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Wafer manufacturing : shaping of single crystal silicon wafers /
"A wafer (often from silicon crystals) is a thin slice of semiconducting material, upon which microcircuits are constructed by doping, etching, and deposition of various materials. Generally, they are cut from a semiconductor using a diamond saw, then polished on one or both faces. Wafer slicin...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Hoboken, NJ :
John Wiley & Sons Ltd,
2021.
|
| Edición: | First edition. |
| Temas: | |
| Acceso en línea: | Texto completo (Requiere registro previo con correo institucional) |
MARC
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| 003 | OCoLC | ||
| 005 | 20231017213018.0 | ||
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| 020 | |a 1118696220 |q electronic book | ||
| 020 | |a 9781118696255 |q electronic book | ||
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| 029 | 1 | |a AU@ |b 000070668424 | |
| 035 | |a (OCoLC)1183400300 | ||
| 037 | |a 9780470061213 |b O'Reilly Media | ||
| 042 | |a pcc | ||
| 050 | 0 | 4 | |a TK7871.85 |b .K295 2021 |
| 082 | 0 | 0 | |a 621.3815/2 |2 23 |
| 049 | |a UAMI | ||
| 100 | 1 | |a Kao, Imin I., |e author. | |
| 245 | 1 | 0 | |a Wafer manufacturing : |b shaping of single crystal silicon wafers / |c Imin Kao, Chunhui Chung. |
| 250 | |a First edition. | ||
| 264 | 1 | |a Hoboken, NJ : |b John Wiley & Sons Ltd, |c 2021. | |
| 264 | 4 | |c Ã2021 | |
| 300 | |a 1 online resource (xiv, 290 pages) : |b illustrations (some color) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b n |2 rdamedia | ||
| 338 | |a online resource |b nc |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index. | ||
| 520 | |a "A wafer (often from silicon crystals) is a thin slice of semiconducting material, upon which microcircuits are constructed by doping, etching, and deposition of various materials. Generally, they are cut from a semiconductor using a diamond saw, then polished on one or both faces. Wafer slicing is the first post crystal-growth step toward producing a polished wafer for electronic device fabrication in the semiconductor and photovoltaic (PV) industry. Advanced slicing technologies such as wiresawing are nowadays widely used in wafer production because of its ability to cut single crystalline and polycrystalline crystals with large diameter and produce wafers from thick (a few mm) to very thin sizes (300 microns)."-- |c Provided by publisher. | ||
| 588 | |a Description based on online resource; title from digital title page (viewed on April 21, 2021). | ||
| 590 | |a O'Reilly |b O'Reilly Online Learning: Academic/Public Library Edition | ||
| 650 | 0 | |a Semiconductor wafers |x Design and construction. | |
| 650 | 7 | |a Semiconductor wafers |x Design and construction |2 fast | |
| 700 | 1 | |a Chung, Chunhui, |e author. | |
| 776 | 0 | 8 | |i Print version: |a Kao, Imin I.. |t Wafer manufacturing |b First edition. |d Hoboken, NJ : Wiley, 2021. |z 9780470061213 |w (DLC) 2020034639 |
| 856 | 4 | 0 | |u https://learning.oreilly.com/library/view/~/9780470061213/?ar |z Texto completo (Requiere registro previo con correo institucional) |
| 994 | |a 92 |b IZTAP | ||