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Silicon-on-insulator (SOI) technology : manufacture and applications /
Silicon-on-insulator (SOI) is a semiconductor wafer technology that produces higher performing, lower power devices than traditional bulk silicon techniques. SOI works by placing a thin, insulating layer, such as silicon oxide between a thin layer of silicon and the silicon substrate. This process h...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Cambridge, UK ; Waltham, MA :
Woodhead Pub.,
2014.
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| Colección: | Woodhead Publishing series in electronic and optical materials.
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| Temas: | |
| Acceso en línea: | Texto completo (Requiere registro previo con correo institucional) |
MARC
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| 245 | 0 | 0 | |a Silicon-on-insulator (SOI) technology : |b manufacture and applications / |c edited by Oleg Kononchuk, Bich-Yen Nguyen. |
| 260 | |a Cambridge, UK ; |a Waltham, MA : |b Woodhead Pub., |c 2014. | ||
| 300 | |a 1 online resource : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Woodhead Publishing series in electronic and optical materials | |
| 588 | 0 | |a Online resource; title from title page (Safari, viewed August 20, 2014). | |
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Cover; Silicon-on-insulator (SOI) Technology : Manufacture and Applications; Copyright; Contents; Contributor contact details; Woodhead Publishing Series in Electronic and Optical Materials; Introduction; Part I:Silicon-on-insulator (SOI) materials and manufacture; 1:Materials and manufacturing techniques for silicon-on-insulator (SOI) wafer technology; 1.1 Introduction; 1.2 SOI wafer fabrication technologies: an overview; 1.3 SOI volume-fabrication process; 1.4 SOI wafer structures and characterization; 1.5 Direct wafer bonding: wet surface cleaning techniques. | |
| 505 | 8 | |a 1.6 Characterization of direct bonding mechanisms1.7 Alternative surface preparation processes for Si and SiO2 direct bonding; 1.8 Mass production of SOI substrates by ion implantation, bonding and splitting: Smart Cut TM technology; 1.9 Fabrication of more complex SOI structures; 1.10 Fabrication of heterogeneous structures; 1.11 Conclusion; 1.12 Acknowledgments; 1.13 References; 2:Characterization of the electrical properties of advanced silicon-on-insulator (SOI) materials and transistors; 2.1 Introduction; 2.2 Conventional characterization techniques. | |
| 505 | 8 | |a 2.3 Characterization of SOI wafers using the pseudo-metal oxide semiconductor field effect transister (MOSFET) technique2.4 Developments in the pseudo-MOSFET technique; 2.5 Conventional methods for the characterization of FD MOSFETs; 2.6 Advanced methods for the characterization of FD MOSFETs; 2.7 Characterization of ultrathin SOI MOSFETs; 2.8 Characterization of multiple-gate MOSFETs; 2.9 Characterization of nanowire FETs; 2.10 Conclusions; 2.11 Acknowledgments; 2.12 References. | |
| 505 | 8 | |a 3: Modeling the performance of short-channel fully depleted silicon-on-insulator (SOI) metal oxide semiconductor field effect transistors (MOSFETs)3.1 Introduction; 3.2 The development of SOI MOSFET modeling; 3.3 A 1-D compact capacitive model for a SOI MOSFET; 3.4 A 2-D analytical model for a SOI MOSFET; 3.5 Modeling of dual gate and other types of SOI MOSFET architecture; 3.6 References; 4:Partially depleted (PD) silicon-on-insulator (SOI) technology: circuit solutions; 4.1 Introduction; 4.2 PDSOI technology and devices; 4.3 Circuit solutions: digital circuits. | |
| 505 | 8 | |a 4.4 Circuit solutions: static random access memory (SRAM) circuits4.5 SRAM margining: PDSOI example; 4.6 Future trends; 4.7 References; 5:Planar fully depleted (FD) silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) technology; 5.1 Introduction; 5.2 Planar FDSOI technology; 5.3 VT adjustment on FDSOI: channel doping, gate stack engineering and ground planes; 5.4 Substrate requirements for FDSOI CMOS devices: BOX and channel thicknesses; 5.5 Strain options on FDSOI; 5.6 Performance without and with back bias; 5.7 Conclusion; 5.8 Acknowledgements; 5.9 References. | |
| 520 | |a Silicon-on-insulator (SOI) is a semiconductor wafer technology that produces higher performing, lower power devices than traditional bulk silicon techniques. SOI works by placing a thin, insulating layer, such as silicon oxide between a thin layer of silicon and the silicon substrate. This process helps reduce junction capacitance, resulting in higher speed and lower power consumption. SOI chips can be as much as 15 percent faster and use 20 percent less power than today's silicon complementary metal-oxide semiconductor (CMOS)-based chips. Part one covers SOI transistors and circuits, manufact. | ||
| 590 | |a O'Reilly |b O'Reilly Online Learning: Academic/Public Library Edition | ||
| 650 | 0 | |a Silicon-on-insulator technology. | |
| 650 | 6 | |a Silicium sur isolant. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Silicon-on-insulator technology. |2 fast |0 (OCoLC)fst01118704 | |
| 655 | 7 | |a Conference papers and proceedings. |2 fast |0 (OCoLC)fst01423772 | |
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| 655 | 7 | |a Actes de congrès. |2 rvmgf | |
| 700 | 1 | |a Kononchuk, Oleg. | |
| 700 | 1 | |a Nguyen, Bich-Yen. | |
| 776 | 0 | 8 | |i Print version: |z 9781306949132 |
| 830 | 0 | |a Woodhead Publishing series in electronic and optical materials. | |
| 856 | 4 | 0 | |u https://learning.oreilly.com/library/view/~/9780857095268/?ar |z Texto completo (Requiere registro previo con correo institucional) |
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