Newnes electronics assembly handbook /

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Recently electronics assemblers have started to define the requirements for new component types from the manufacturer which means that not only can the components be designed to fit an existing assembly method, but that new assembly methods can be developed for which components can be specified.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Brindley, Keith
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Oxford : Heinemann Newnes, 1990.
Temas:
Electronic apparatus and appliances > Design and construction.
Printed circuits > Design and construction.
Surface mount technology.
Electronic packaging.
Appareils électroniques > Conception et construction.
Montage en surface (Électronique)
Mise sous boîtier (Électronique)
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic apparatus and appliances > Design and construction
Electronic packaging
Printed circuits > Design and construction
Surface mount technology
Acceso en línea:Texto completo (Requiere registro previo con correo institucional)
Tabla de Contenidos:
  • Front Cover; Newnes Electronics Assembly Handbook; Copyright Page; Table of Contents; Preface; Chapter 1. Introduction; Bringing together varied disciplines; Applications; Standardization; Book layout and description; Chapter 2. Electronics assembly: the PCB; The printed circuit board; Base materials; Basic mechanical properties; PCB manufacture; PCB manufacturing processes; Design; Layout; Through-hole PCB assembly; Testing; Cleaning of assemblies; Conformal coatings; Total automatic assembly; Chapter 3. Electronics assembly: the SMA; Surface mounted assemblies; Advantages and disadvantages
  • Surface mounted componentsBase materials; Thermal design of surface mounted assemblies; Design; Assembly; Assembly variations; Testing assemblies; Component placement; References; Chapter 4. Electromechanical assembly: packaging; Packaging engineering; Adhesives; Thermal management; Environmental considerations; Electromagnetic compatability; References; Chapter 5. Soldering; Changing face; Requirements of the soldering process; Solderability and protective coatings; Soldering processes; Solder; Flux; Types of joints; Solder resists; Hand soldering; Mass CS soldering
  • wave soldering
  • Mass SC reflow solderingComparison of soldering processes; Cleaning of PCBs; References; Chapter 6. Testing for quality; The philosophy of quality; Reliability; Component parts testing; Production processes; The unpackaged assembly; The packaged assembly; References; Chapter 7. Standardization of electronics manufacture: quality assurance; Standards; Reference to standards; Levels of standards; Standards organizations and bodies; The work of BSI; BSS; Assessed capability of companies; Assessed quality of components; Setting up company standards; References
  • Chapter 8. Selling to the Ministry of DefenceMoD organization; Procurement executive; Procurement executive policy and procedures; Quality assurance; Glossary; Appendix 1: Worldwide standards; Guide to relevant worldwide standards, by subject; Guide to relevant worldwide standards, by reference; Appendix 2: Worldwide addresses; UK Governmental Departments; Institutions and associations; Standards organizations and bodies; Appendix 3: Further reading; Index

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