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Heat transfer : thermal management of electronics /
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems. Heat Transfer: Thermal Manag...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boca Raton, FL :
CRC Press,
©2010.
|
| Temas: | |
| Acceso en línea: | Texto completo (Requiere registro previo con correo institucional) |
MARC
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| 100 | 1 | |a Shabany, Younes. | |
| 245 | 1 | 0 | |a Heat transfer : |b thermal management of electronics / |c Younes Shabany. |
| 260 | |a Boca Raton, FL : |b CRC Press, |c ©2010. | ||
| 300 | |a 1 online resource (xv, 491 pages, 16 unnumbered leaves of color plates) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 588 | 0 | |a Online resource; title from digital title page (viewed on April 2, 2019). | |
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | 0 | |g Ch. 1. |t Introduction -- |g Ch. 2. |t Energy, Energy Transfer, and Heat Transfer -- |g Ch. 3. |t Principle of Conservation of Energy -- |g Ch. 4. |t Heat Transfer Mechanisms -- |g Ch. 5. |t Thermal Resistance Network -- |g Ch. 6. |t Thermal Specification of Microelectric Packages -- |g Ch. 7. |t Fins and Heat Sinks -- |g Ch. 8. |t Heat Conduction Equation -- |g Ch. 9. |t Fundamentals of Convection Heat Transfer -- |g Ch. 10. |t Forced Convection Heat Transfer: External Flows -- |g Ch. 11. |t Forced Convection Heat Transfer: Internal Flows -- |g Ch. 12. |t Natural Convection Heat Transfer -- |g Ch. 13. |t Radiation Heat Transfer -- |g Ch. 14. |t Computer Simulations and Thermal Design -- |g Ch. 15. |t Experimental Techniques and Thermal Design -- |g Ch. 16. |t Advanced Cooling Technologies -- |g Appendix. |t Tables of Material Properties. |
| 520 | |a The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems. Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase. The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods. With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer. | ||
| 590 | |a O'Reilly |b O'Reilly Online Learning: Academic/Public Library Edition | ||
| 650 | 0 | |a Electronic apparatus and appliances |x Thermal properties. | |
| 650 | 0 | |a Electronic apparatus and appliances |x Protection. | |
| 650 | 0 | |a Heat sinks (Electronics) | |
| 650 | 0 | |a Electronic packaging. | |
| 650 | 0 | |a System failures (Engineering) |x Prevention. | |
| 650 | 6 | |a Appareils électroniques |x Propriétés thermiques. | |
| 650 | 6 | |a Appareils électroniques |x Protection. | |
| 650 | 6 | |a Dissipateurs thermiques (Électronique) | |
| 650 | 6 | |a Mise sous boîtier (Électronique) | |
| 650 | 6 | |a Pannes |x Prévention. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Electronic apparatus and appliances |x Protection |2 fast | |
| 650 | 7 | |a Electronic apparatus and appliances |x Thermal properties |2 fast | |
| 650 | 7 | |a Electronic packaging |2 fast | |
| 650 | 7 | |a Heat sinks (Electronics) |2 fast | |
| 650 | 7 | |a Wärmeübertragung |2 gnd | |
| 655 | 0 | |a Electronic books. | |
| 655 | 4 | |a Electronic books. | |
| 776 | 0 | 8 | |i Print version: |a Shabany, Younes. |t Heat transfer. |d Boca Raton : CRC Press, ©2010 |z 9781439814673 |w (DLC) 2009042415 |w (OCoLC)461895348 |
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