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3D integration for VLSI systems /
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boca Raton, Fla. :
CRC Press,
2012.
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| Temas: | |
| Acceso en línea: | Texto completo (Requiere registro previo con correo institucional) |
Tabla de Contenidos:
- Ch. 1. 3D integration technology : introduction and overview / Chuan Seng Tan, Kuan-Neng Chen and Steven J. Koester
- ch. 2. A systems perspective on 3D integration : what is 3D? And what is 3D good for? / Phil Emma and Eren Kursun
- ch. 3. Wafer bonding techniques / Bioh Kim [and others]
- ch. 4. TSV etching / Paul Werbaneth
- ch. 5. TSV filling / Arthur Keigler
- ch. 6. 3D technology platform : temporary bonding and release / Mark Privett
- ch. 7. 3D technology platform : wafer thinning, stress relief, and thin wafer handling / Scott Sullivan
- ch. 8. Advanced die-to-wafer 3D integration platform : self-assembly technology / Takafum Fukushima [and others]
- ch. 9. Advanced direct bond technology / Paul Enquist
- ch. 10. Surface modification bonding at low temperature for three-dimensional hetero-integration / Akitsu Shigetou
- ch. 11. Through silicon via implementation in CMOS image sensor product / Xavier Gagnard and Nicolas Hotellier
- ch. 12. A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via hybrid Cu-adhesive bonding / Fei Liu
- ch. 13. Power delivery in 3D IC technology with a stratum having an array of monolithic DC-DC point-of-load (PoL) converter cells / Ron Rutman and Jian Sun
- ch. 14. Thermal-aware 3D IC designs / Xiaoxia Wu, Yuan Xie and Vijaykirshnan Narayanan
- ch. 15. 3D IC design automation considering dynamic power and thermal integrity / Hao Yu and Xiwei Huang
- ch. 16. Outlook / Ya Lan Yang.