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|a 3D integration for VLSI systems /
|c edited by Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester.
|
| 260 |
|
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|a Boca Raton, Fla. :
|b CRC Press,
|c 2012.
|
| 300 |
|
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|a 1 online resource (viii, 366 pages) :
|b illustrations (some color)
|
| 336 |
|
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|a text
|b txt
|2 rdacontent
|
| 337 |
|
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|a computer
|b c
|2 rdamedia
|
| 338 |
|
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|a online resource
|b cr
|2 rdacarrier
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| 347 |
|
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|a data file
|2 rda
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| 504 |
|
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|a Includes bibliographical references.
|
| 505 |
0 |
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|a Ch. 1. 3D integration technology : introduction and overview / Chuan Seng Tan, Kuan-Neng Chen and Steven J. Koester -- ch. 2. A systems perspective on 3D integration : what is 3D? And what is 3D good for? / Phil Emma and Eren Kursun -- ch. 3. Wafer bonding techniques / Bioh Kim [and others] -- ch. 4. TSV etching / Paul Werbaneth -- ch. 5. TSV filling / Arthur Keigler -- ch. 6. 3D technology platform : temporary bonding and release / Mark Privett -- ch. 7. 3D technology platform : wafer thinning, stress relief, and thin wafer handling / Scott Sullivan -- ch. 8. Advanced die-to-wafer 3D integration platform : self-assembly technology / Takafum Fukushima [and others] -- ch. 9. Advanced direct bond technology / Paul Enquist -- ch. 10. Surface modification bonding at low temperature for three-dimensional hetero-integration / Akitsu Shigetou -- ch. 11. Through silicon via implementation in CMOS image sensor product / Xavier Gagnard and Nicolas Hotellier -- ch. 12. A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via hybrid Cu-adhesive bonding / Fei Liu -- ch. 13. Power delivery in 3D IC technology with a stratum having an array of monolithic DC-DC point-of-load (PoL) converter cells / Ron Rutman and Jian Sun -- ch. 14. Thermal-aware 3D IC designs / Xiaoxia Wu, Yuan Xie and Vijaykirshnan Narayanan -- ch. 15. 3D IC design automation considering dynamic power and thermal integrity / Hao Yu and Xiwei Huang -- ch. 16. Outlook / Ya Lan Yang.
|
| 546 |
|
|
|a English.
|
| 590 |
|
|
|a O'Reilly
|b O'Reilly Online Learning: Academic/Public Library Edition
|
| 650 |
|
0 |
|a Integrated circuits
|x Very large scale integration.
|
| 650 |
|
0 |
|a Linear integrated circuits.
|
| 650 |
|
0 |
|a Three-dimensional imaging.
|
| 650 |
|
2 |
|a Imaging, Three-Dimensional
|
| 650 |
|
6 |
|a Circuits intégrés à très grande échelle.
|
| 650 |
|
6 |
|a Circuits intégrés linéaires.
|
| 650 |
|
6 |
|a Imagerie tridimensionnelle.
|
| 650 |
|
7 |
|a three-dimensional.
|2 aat
|
| 650 |
|
7 |
|a COMPUTERS
|x Logic Design.
|2 bisacsh
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x Logic.
|2 bisacsh
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x VLSI & ULSI.
|2 bisacsh
|
| 650 |
|
7 |
|a Integrated circuits
|x Very large scale integration.
|2 fast
|0 (OCoLC)fst00975602
|
| 650 |
|
7 |
|a Linear integrated circuits.
|2 fast
|0 (OCoLC)fst00999073
|
| 650 |
|
7 |
|a Three-dimensional imaging.
|2 fast
|0 (OCoLC)fst01150331
|
| 700 |
1 |
|
|a Tan, Chuan Seng.
|
| 700 |
1 |
|
|a Chen, Kuan-Neng.
|
| 700 |
1 |
|
|a Koester, Steven J.
|
| 776 |
0 |
8 |
|i Print version:
|t 3D integration for VLSI systems.
|d Singapore : Pan Stanford Pub., ©2012
|z 9789814303811
|w (OCoLC)772288627
|
| 856 |
4 |
0 |
|u https://learning.oreilly.com/library/view/~/9789814303828/?ar
|z Texto completo (Requiere registro previo con correo institucional)
|
| 938 |
|
|
|a Taylor & Francis
|b TAFR
|n 9780429067464
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| 938 |
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