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Semiconductor Packaging : Materials Interaction and Reliability.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
| Clasificación: | Libro Electrónico |
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| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Hoboken :
CRC Press,
2011.
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| Temas: | |
| Acceso en línea: | Texto completo (Requiere registro previo con correo institucional) |
Tabla de Contenidos:
- Front Cover; Contents; Preface; Authors; Partial list of abbreviations, acronyms, and symbols; Chapter 1: History and background; Chapter 2: Package form factors and families; Chapter 3: Surface-mount technology; Chapter 4: Other packaging needs; Chapter 5: Reliability testing; Chapter 6: Polymers; Chapter 7: Metals; Chapter 8: Ceramics and glasses; Chapter 9: Trends and challenges; Chapter 10: Light-emitting diodes; Glossary; Appendix A: Analytical tools; Appendix B: Destructive tools and tests; Back Cover.