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Semiconductor Packaging : Materials Interaction and Reliability.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Hoboken :
CRC Press,
2011.
|
| Temas: | |
| Acceso en línea: | Texto completo (Requiere registro previo con correo institucional) |
MARC
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|---|---|---|---|
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| 049 | |a UAMI | ||
| 100 | 1 | |a Chen, Andrea. | |
| 245 | 1 | 0 | |a Semiconductor Packaging : |b Materials Interaction and Reliability. |
| 260 | |a Hoboken : |b CRC Press, |c 2011. | ||
| 300 | |a 1 online resource (208 pages) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 347 | |a data file | ||
| 505 | 0 | |a Front Cover; Contents; Preface; Authors; Partial list of abbreviations, acronyms, and symbols; Chapter 1: History and background; Chapter 2: Package form factors and families; Chapter 3: Surface-mount technology; Chapter 4: Other packaging needs; Chapter 5: Reliability testing; Chapter 6: Polymers; Chapter 7: Metals; Chapter 8: Ceramics and glasses; Chapter 9: Trends and challenges; Chapter 10: Light-emitting diodes; Glossary; Appendix A: Analytical tools; Appendix B: Destructive tools and tests; Back Cover. | |
| 520 | |a In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how. | ||
| 588 | 0 | |a Print version record. | |
| 504 | |a Includes bibliographical references. | ||
| 590 | |a O'Reilly |b O'Reilly Online Learning: Academic/Public Library Edition | ||
| 650 | 0 | |a Microelectronic packaging. | |
| 650 | 6 | |a Mise sous boîtier (Microélectronique) | |
| 650 | 7 | |a Microelectronic packaging. |2 fast |0 (OCoLC)fst01019751 | |
| 655 | 4 | |a Electronic resource. | |
| 776 | 0 | 8 | |i Print version: |a Chen, Andrea. |t Semiconductor Packaging : Materials Interaction and Reliability. |d Hoboken : CRC Press, ©2011 |z 9781439862056 |
| 856 | 4 | 0 | |u https://learning.oreilly.com/library/view/~/9781439862070/?ar |z Texto completo (Requiere registro previo con correo institucional) |
| 938 | |a CRC Press |b CRCP |n CRC0KE13046PDF | ||
| 938 | |a ProQuest MyiLibrary Digital eBook Collection |b IDEB |n 327460 | ||
| 994 | |a 92 |b IZTAP | ||