Characterization of integrated circuit packaging materials /

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Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues ar...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Moore, Thomas M., McKenna, Robert G.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Boston : Butterworth-Heinemann, ©1993.
Colección:Materials characterization series.
Temas:
Electronic packaging > Materials.
Integrated circuits > Design and construction.
Mise sous boîtier (Électronique) > Matériaux.
Circuits intégrés > Conception et construction.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic packaging > Materials
Integrated circuits > Design and construction
Electronic equipment > Packaging
Acceso en línea:Texto completo (Requiere registro previo con correo institucional)
Tabla de Contenidos:
  • Front Cover; Characterization of Integrated Circuit Packaging Materials; Copyright Page; Table of Contents; Foreword; Preface to Series; Preface; Contributors; Chapter 1. IC Package Reliability Testing; 1.1 Introduction; 1.2 In-Process Quality Measurements; 1.3 Package-Oriented Reliability Testing of Finished Devices:Moisture Testing; 1.4 Package-Oriented Reliability Testing of Finished Devices:Thermal Cycle Testing; 1.5 Reliability Test Preconditioning: A New Direction; 1.6 Summary; References; Chapter 2. Mold Compound Adhesion and Strength; 2.1 Introduction
  • 2.2 Thermodynamic Consideration of Adhesion2.3 Adhesive Strength for Various Mold Compound Types; 2.4 Various Factors Which Influence Adhesion Strength; 2.5 Role of Adhesion in Surface Mount Operations; 2.6 Role of Adhesion in Package Reliability; 2.7 Physical Characterization of Mold Compounds; 2.8 Outlook for Future Mold Compounds; 2.9 Summary; References; Chapter 3. Mechanical Stress in IC Packages; 3.1 Introduction; 3.2 Stress and Strain Relations: An Overview; 3.3 Stress Generation in IC Packages; 3.4 Tools for Stress Determination in IC Packages
  • 3.5 Application of Techniques to IC Packaging Problems3.6 Solder Joint Stress and the Coffin-Manson Relation; 3.7 Summary; References; Chapter 4. Moisture Sensitivity and Delamination; 4.1 Introduction; 4.2 Moisture/Reflow Sensitivity Evaluations; 4.3 Impact on Temperature-Cycle Performance; 4.4 Impact on THB Performance; 4.5 Moisture Desorption: Bake-Out; 4.6 Summary; References; Chapter 5. Thermal Management; 5.1 Introduction; 5.2 IC Package Thermal Characteristics; 5.3 Factors Affecting Package Thermal Resistance; 5.4 Thermal Design Challenges of Multi-Chip Modules; 5.5 Summary; References
  • Chapter 6. Electrical Performance of IC Packages6.1 Introduction; 6.2 Designing for Performance; 6.3 Electrical Models for Packages and Interconnects; 6.4 Propagation Delay and Packaging; 6.5 Switching Noise; 6.6 Signal Integrity; 6.7 Crosstalk; 6.8 Materials and Design Trends for High-Performance Packaging; 6.9 Summary; References; Chapter 7. Solderability of Integrated Circuits; 7.1 Introduction; 7.2 Electronic Soldering Basics; 7.3 IC Package Designs, Materials, and Solderability Test Methods; 7.4 IC Solderability Defects; 7.5 Solderability of IC Packages to PCBs; 7.6 Summary; References
  • Chapter 8. Hermeticity and Joining in Ceramic IC Packages8.1 Introduction; 8.2 Materials for Hermetic IC Packaging; 8.3 Hermeticity Testing-History; 8.4 Theory of Hermeticity Testing; 8.5 Gross-Leak Testing Methodology; 8.6 Hermeticity Failure Analysis; 8.7 Alternatives to Hermetic Packaging; 8.8 Summary; References; Chapter 9. Advanced Interconnect Technologies; 9.1 Introduction; 9.2 MCM Technology Classifications; 9.3 MCM Materials Selection; 9.4 Die Mounting and Stress; 9.5 Die Interconnection; 9.6 MCM Packages; 9.7 Summary; References; Appendix: Technique Summaries

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