Characterization of integrated circuit packaging materials /

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Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues ar...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Moore, Thomas M., McKenna, Robert G.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Boston : Butterworth-Heinemann, ©1993.
Colección:Materials characterization series.
Temas:
Electronic packaging > Materials.
Integrated circuits > Design and construction.
Mise sous boîtier (Électronique) > Matériaux.
Circuits intégrés > Conception et construction.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic packaging > Materials
Integrated circuits > Design and construction
Electronic equipment > Packaging
Acceso en línea:Texto completo (Requiere registro previo con correo institucional)

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