Characterization of integrated circuit packaging materials /

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Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues ar...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Moore, Thomas M., McKenna, Robert G.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Boston : Butterworth-Heinemann, ©1993.
Colección:Materials characterization series.
Temas:
Electronic packaging > Materials.
Integrated circuits > Design and construction.
Mise sous boîtier (Électronique) > Matériaux.
Circuits intégrés > Conception et construction.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic packaging > Materials
Integrated circuits > Design and construction
Electronic equipment > Packaging
Acceso en línea:Texto completo (Requiere registro previo con correo institucional)
Descripción
Sumario:Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Descripción Física:1 online resource (xviii, 274 pages) : illustrations
Bibliografía:Includes bibliographical references and index.
ISBN:9781483292342
1483292347

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