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Semiconductor Manufacturing Handbook, Second Edition /
Thoroughly revised, state-of-the-art semiconductor design, manufacturing, and operations information. Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2017].
|
| Edición: | 2nd edition. |
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Cover
- Title Page
- Copyright Page
- Dedication
- About the Editor
- Contents in Brief
- Contents
- Technical Advisory Board
- Contributors
- Foreword
- Preface
- Acknowledgments
- Part 1 Semiconductor Manufacturing Fundamentals
- Chapter 1. Semiconductor Manufacturing, the Internet of Things, and Sustainability
- Chapter 2. Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-Based Materials and Beyond
- Chapter 3. Fundamentals of FinFET and Recent Advances in Nanoscale Silicide Formation
- Chapter 4. Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT
- Chapter 5. Physical Design for High-Performance, Low-Power, and Reliable 3D Integrated Circuits
- Part 2 Front-End-of-Line Processes
- Chapter 6. Epitaxy Jamal Ramdani
- Chapter 7. Thermal Processing: Anneals, RTP, and Oxidation
- Chapter 8. Microlithography
- Chapter 9. Etching
- Chapter 10. Ion Implantation
- Chapter 11. Introduction to Physical Vapor Deposition
- Chapter 12. Chemical Vapor Deposition
- Chapter 13. Atomic Layer Deposition
- Chapter 14. Electrochemical Deposition
- Chapter 15. Fundamentals of Chemical Mechanical Planarization
- Chapter 16. AFM Metrology
- Part 3 Back-End-of-Line Processes
- Chapter 17. Wafer Thinning and Singulation
- Chapter 18. Packaging
- Chapter 19. Bonding Fundamentals
- Chapter 20. Interconnects Reliability
- Chapter 21. Automatic Test Equipment
- Part 4 Technologies for Flexible Hybrid Electronics and Large-Area Electronics
- Chapter 22. Printed Electronics: Principles, Materials, Processes, and Applications
- Chapter 23. Flexible Hybrid Electronics
- Chapter 24. Flexible Electronics
- Chapter 25. RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications
- Chapter 26. Printing of Nanoscale Electronics and Power Electronics
- Chapter 27. 3D Interconnects in Flexible Electronics
- Chapter 28. Materials for the Manufacturing of an Inkjet Printed Touch Sensor
- Chapter 29. Flat-Panel and Flexible Display Technology
- Chapter 30. Photovoltaics Fundamentals, Manufacturing, Installation, and Operations
- Part 5 Process Gases and Chemicals
- Chapter 31. Gas Distribution Systems
- Chapter 32. Fundamentals of Ultrapure Water
- Chapter 33. Process Chemicals, Handling, and Abatement
- Chapter 34. Filtration
- Chapter 35. Chemical and Slurry Handling Systems
- Part 6 Operations, Equipment, and Facilities
- Chapter 36. Yield Management
- Chapter 37. CIM and Factory Automation
- Chapter 38. MES Fundamentals
- Chapter 39. Advanced Process Control
- Chapter 40. Airborne Molecular Contamination
- Chapter 41. ESD Controls in Cleanroom Environments
- Chapter 42. Vacuum Systems
- Chapter 43. Control of RF Plasma Processing
- Chapter 44. IC Manufacturing Equipment Parts Cleaning Technology: Fundamentals and Applications
- Chapter 45. Equipment Design Challenges due to Increasing Hazards and Regulations
- Chapter 46. Cleanroom Design and Construction
- Chapter 47. Vibration and Noise Design
- Index
- A
- B
- C
- D
- E
- F
- G
- H
- I
- J
- K
- L
- M
- N
- O
- P
- Q
- R
- S
- T
- U
- V
- W
- X
- Y
- Z.