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Semiconductor Manufacturing Handbook, Second Edition /
Thoroughly revised, state-of-the-art semiconductor design, manufacturing, and operations information. Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2017].
|
| Edición: | 2nd edition. |
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 020 | |a 9781259583124 (e-ISBN) | ||
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| 082 | 0 | 4 | |a 621.3815 |2 23 |
| 100 | 1 | |a Geng, Hwaiyu, |e author. | |
| 245 | 1 | 0 | |a Semiconductor Manufacturing Handbook, Second Edition / |c Hwaiyu Geng. |
| 250 | |a 2nd edition. | ||
| 264 | 1 | |a New York, N.Y. : |b McGraw-Hill Education, |c [2017]. | |
| 264 | 4 | |c ?2017. | |
| 300 | |a 1 online resource (704 pages) : |b 400 illustrations. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a computer |2 rdamedia | ||
| 338 | |a online resource |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Cover -- Title Page -- Copyright Page -- Dedication -- About the Editor -- Contents in Brief -- Contents -- Technical Advisory Board -- Contributors -- Foreword -- Preface -- Acknowledgments -- Part 1 Semiconductor Manufacturing Fundamentals -- Chapter 1. Semiconductor Manufacturing, the Internet of Things, and Sustainability -- Chapter 2. Nanotechnology and Nanomanufacturing: From Silicon to New Carbon-Based Materials and Beyond -- Chapter 3. Fundamentals of FinFET and Recent Advances in Nanoscale Silicide Formation -- Chapter 4. Foundations of Microsystems Manufacturing: An Empowering Technology for the IoT -- Chapter 5. Physical Design for High-Performance, Low-Power, and Reliable 3D Integrated Circuits -- Part 2 Front-End-of-Line Processes -- Chapter 6. Epitaxy Jamal Ramdani -- Chapter 7. Thermal Processing: Anneals, RTP, and Oxidation -- Chapter 8. Microlithography -- Chapter 9. Etching -- Chapter 10. Ion Implantation -- Chapter 11. Introduction to Physical Vapor Deposition -- Chapter 12. Chemical Vapor Deposition -- Chapter 13. Atomic Layer Deposition -- Chapter 14. Electrochemical Deposition -- Chapter 15. Fundamentals of Chemical Mechanical Planarization -- Chapter 16. AFM Metrology -- Part 3 Back-End-of-Line Processes -- Chapter 17. Wafer Thinning and Singulation -- Chapter 18. Packaging -- Chapter 19. Bonding Fundamentals -- Chapter 20. Interconnects Reliability -- Chapter 21. Automatic Test Equipment -- Part 4 Technologies for Flexible Hybrid Electronics and Large-Area Electronics -- Chapter 22. Printed Electronics: Principles, Materials, Processes, and Applications -- Chapter 23. Flexible Hybrid Electronics -- Chapter 24. Flexible Electronics -- Chapter 25. RF Printed Electronics: Communication, Sensing, and Energy Harvesting for the Internet of Things and Smart Skin Applications -- Chapter 26. Printing of Nanoscale Electronics and Power Electronics -- Chapter 27. 3D Interconnects in Flexible Electronics -- Chapter 28. Materials for the Manufacturing of an Inkjet Printed Touch Sensor -- Chapter 29. Flat-Panel and Flexible Display Technology -- Chapter 30. Photovoltaics Fundamentals, Manufacturing, Installation, and Operations -- Part 5 Process Gases and Chemicals -- Chapter 31. Gas Distribution Systems -- Chapter 32. Fundamentals of Ultrapure Water -- Chapter 33. Process Chemicals, Handling, and Abatement -- Chapter 34. Filtration -- Chapter 35. Chemical and Slurry Handling Systems -- Part 6 Operations, Equipment, and Facilities -- Chapter 36. Yield Management -- Chapter 37. CIM and Factory Automation -- Chapter 38. MES Fundamentals -- Chapter 39. Advanced Process Control -- Chapter 40. Airborne Molecular Contamination -- Chapter 41. ESD Controls in Cleanroom Environments -- Chapter 42. Vacuum Systems -- Chapter 43. Control of RF Plasma Processing -- Chapter 44. IC Manufacturing Equipment Parts Cleaning Technology: Fundamentals and Applications -- Chapter 45. Equipment Design Challenges due to Increasing Hazards and Regulations -- Chapter 46. Cleanroom Design and Construction -- Chapter 47. Vibration and Noise Design -- Index -- A -- B -- C -- D -- E -- F -- G -- H -- I -- J -- K -- L -- M -- N -- O -- P -- Q -- R -- S -- T -- U -- V -- W -- X -- Y -- Z. | |
| 520 | 3 | |a Thoroughly revised, state-of-the-art semiconductor design, manufacturing, and operations information. Written by 70 international experts and reviewed by a seasoned technical advisory board, this fully updated resource clearly explains the cutting-edge processes used in the design and fabrication of IC chips, MEMS, sensors, and other electronic devices. | |
| 530 | |a Also available in print edition. | ||
| 533 | |a Electronic reproduction. |b New York, N.Y. : |c McGraw Hill, |d 2017. |n Mode of access: World Wide Web. |n System requirements: Web browser. |n Access may be restricted to users at subscribing institutions. | ||
| 538 | |a Mode of access: Internet via World Wide Web. | ||
| 546 | |a In English. | ||
| 588 | |a Description based on e-Publication PDF. | ||
| 650 | 0 | |a Semiconductors |x Design and construction |v Handbooks, manuals, etc. | |
| 650 | 0 | |a Integrated circuits |x Design and construction |v Handbooks, manuals, etc. | |
| 650 | 0 | |a Integrated circuits |x Design and construction. | |
| 650 | 0 | |a Semiconductors |x Design and construction. | |
| 655 | 0 | |a Electronic books. | |
| 776 | 1 | 8 | |i Print version: |t Semiconductor Manufacturing Handbook. |b Second Edition. |d New York, N.Y. : McGraw Hill, |c [2017], |z 9781259587696 |
| 856 | 4 | 0 | |u https://accessengineeringlibrary.uam.elogim.com/content/book/9781259587696 |z Texto completo |