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Failure Analysis of Engineering Materials /

Suitable for engineers, this work presents a tool for expert investigation and analysis of component failures. It is designed-to-be-used introduction to principals and practices. It includes: 500 illustrations; pinpoints fracture type with comparative fractographs; and can be used as expert examples...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Brooks, Charlie R., 1931- (Autor), Choudhury, A., (Ashok) (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2002].
Edición:1st edition.
Temas:
Acceso en línea:Texto completo
Tabla de Contenidos:
  • A. Dedication
  • B. Preface
  • 1. Introduction
  • CHAPTER PRELIMINARIES
  • Objectives
  • Approach to Failure Analysis of Materials
  • Tools of Failure Analysis
  • Sample Preparation
  • References
  • Bibliography
  • Appendix 1A?Stereomicroscopy
  • Appendix 1B?Care and Handling of Fractures
  • Appendix 1C?Preparation and Preservation of Fracture Specimens
  • Appendix 1D?Cleaning of Fracture Surfaces
  • Appendix 1E?Examination of Cleaning Techniques for Postfailure Analysis
  • Appendix 1F?Recommended Cleaning Solutions for Metallic Fractures
  • Appendix 1G?A Scale and Rust Removal Solution
  • 2. Mechanical Aspects and Macroscopic Fracture-Surface Orientation
  • CHAPTER PRELIMINARIES
  • Introduction
  • Tensile Test
  • Principal Stresses
  • Stress Concentration
  • Triaxial Stress and Constraint
  • Plane Stress
  • Plane Strain
  • Fracture of Tensile Samples
  • Effect of Strain Rate and Temperature
  • Crack Propagation
  • Meaning of Ductile and Brittle Fracture
  • Fracture Mechanics and Failure
  • Fatigue Loading
  • Creep Deformation
  • References
  • Bibliography
  • 3. Fracture Mechanisms and Microfractographic Features
  • CHAPTER PRELIMINARIES
  • Introduction
  • Slip and Cleavage
  • Twinning
  • Cleavage Fracture Topography
  • Void Coalescence
  • Mixed Mechanism and Quasicleavage Fracture
  • Tearing Topography Surface
  • Intergranular Separation
  • Fatigue Fracture Topography
  • High-Temperature Fracture Topography
  • Environmentally Assisted Fracture
  • Flutes
  • Wear
  • Fracture in Ceramics
  • Fracture Mechanisms in Polymeric Materials
  • Stereo Examination of Fracture Surfaces
  • Comparison of SEM and TEM Fractographs
  • Artifacts
  • References
  • Bibliography
  • 4. Fracture Modes and Macrofractographic Features
  • CHAPTER PRELIMINARIES
  • Introduction
  • Tensile Overload
  • Torsion Overload
  • Bending Overload
  • Fatigue Fracture
  • Correlation of Micro- and Macrofractographic Features
  • References
  • Bibliography
  • 5. Failure Analysis of Composites
  • CHAPTER PRELIMINARIES
  • Introduction
  • Polymer Matrix Composites
  • Ceramic Matrix Composites (CMCs)
  • Metal Matrix Composites (MMCs)
  • References
  • 6. Electronic Failure Analysis
  • CHAPTER PRELIMINARIES
  • Introduction
  • Failure Mechanisms
  • Failure Analysis Process
  • Tools and Techniques for Electronic Failure Analysis
  • Failure Analysis of Electronic Packages
  • References
  • 7. Case Studies
  • CHAPTER PRELIMINARIES
  • Introduction
  • Case A: A Cracked Vacuum Bellows
  • Case B: Failure of a Large Air-Conditioning Fan Blade
  • Case C: A Cracked Automobile Flywheel Flex Plate
  • Case D: Failed Welded Railroad Rails
  • Case E: Broken Stainless-Steel Wires from an Electrostatic Precipitator
  • Case F: Broken Wire Cutters
  • Case G: Broken Steel Punch
  • Case H: Broken Stainless-Steel Hinge for a Check Valve
  • References
  • Bibliography
  • A. Appendix A: Temperature Conversions*
  • APPENDIX PRELIMINARIES
  • Temperature Conversions
  • B. Appendix B: Metric Conversion Factors*
  • APPENDIX PRELIMINARIES
  • C. Appendix C: Converting Common Units from the English to the Metric (SI) System*
  • APPENDIX PRELIMINARIES
  • D. Appendix D: Rockwell C and B Hardness Numbers for Steel*
  • APPENDIX PRELIMINARIES
  • E. Appendix E: The Relations between ASTM Grain Size and Average Grain "Diameter"*
  • APPENDIX PRELIMINARIES
  • F. Appendix F: Comments on Magnification Markers
  • APPENDIX PRELIMINARIES
  • G. Appendix G: Acronyms Used in Electronic Failure Analysis
  • APPENDIX PRELIMINARIES
  • H. Glossary*.