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Printed Circuits Handbook, Seventh Edition /
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2016].
|
| Edición: | 7th edition. |
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Cover
- Title Page
- Copyright Page
- Contents
- Contributors
- Preface
- Part 1 Printed Circuit Technology Drivers
- Chapter 1. Electronic Packaging and High-Density Interconnectivity
- Chapter 2. Types of Printed Wiring Boards
- Part 2 Managing the Printed Circuit Supply Chain
- Chapter 3. Basics of Printed Circuit Supply Chain Management
- Chapter 4. Design for Manufacturability
- Chapter 5. Manufacturing Information, Documentation, Formatting, and Exchange
- Chapter 6. Supplier Selection and Qualification
- Chapter 7. Process Control, Monitoring, and Incoming Inspection
- Chapter 8. Product Acceptance and Feedback
- Part 3 Materials
- Chapter 9. Introduction to Base Materials
- Chapter 10. Base Material Components
- Chapter 11. Properties of Base Materials
- Chapter 12. Base Material Performance in PCBs
- Chapter 13. The Impact of Lead-Free Assembly on Base Materials
- Chapter 14. Selecting Base Materials
- Chapter 15. Laminate Qualification and Testing
- Part 4 Engineering and Design
- Chapter 16. Planning for Design, Fabrication, and Assembly
- Chapter 17. Physical Characteristics of the PCB
- Chapter 18. Electronic Design Automation and Printed Circuit Design Tools
- Chapter 19. The PCB Design Process
- Chapter 20. Electrical and Mechanical Design Parameters
- Chapter 21. The Basics of Printed Circuit Board Design
- Chapter 22. Current Carrying Capacity in Printed Circuits
- Chapter 23. PCB Design for Thermal Performance
- Chapter 24. Embedded Components
- Part 5 High- Density Interconnection
- Chapter 25. Introduction to High-Density Interconnection Technology
- Chapter 26. Advanced High-Density Interconnection Technologies
- Part 6 Fabrication
- Chapter 27. CAM Tooling for Fab and Assembly
- Chapter 28. Drilling Processes
- Chapter 29. Precision Interconnect and Laser Drilling
- Chapter 30. Imaging and Automated Optical Inspection
- Chapter 31. Multilayer Materials and Processing
- Chapter 32. Preparing Boards for Plating
- Chapter 33. Electroplating
- Chapter 34. Direct Plating
- Chapter 35. Printed Circuit Board Surface Finishes
- Chapter 36. Solder Mask
- Chapter 37. Etching Process and Technologies
- Chapter 38. Routing and V-Scoring
- Part 7 Bare Board Test
- Chapter 39. Bare Board Test Objectives and Definitions
- Chapter 40. Bare Board Test Methods
- Chapter 41. Bare Board Test Equipment
- Chapter 42. HDI Bare Board Special Testing Methods
- Part 8 Assembly, Soldering Materials, and Processes
- Chapter 43. Assembly Processes
- Chapter 44. Conformal Coating
- Chapter 45. Fluxes and Cleaning
- Chapter 46. Soldering Fundamentals
- Chapter 47. Soldering Materials and Metallurgy
- Chapter 48. Solder Fluxes
- Chapter 49. Soldering Techniques
- Chapter 50. Soldering Repair and Rework
- Part 9 Nonsolder Interconnection
- Chapter 51. Press-Fit Interconnection
- Chapter 52. Pressure-Interconnect Land Grid Array Systems
- Part 10 Quality
- Chapter 53. Acceptability and Quality of Fabricated Boards
- Chapter 54. Acceptability of Printed Circuit Board Assemblies
- Chapter 55. Asssembly Inspection
- Chapter 56. Design for Testing
- Chapter 57. Loaded Board Testing
- Chapter 58. Failure Modes and Effects Analysis
- Part 11 Reliability
- Chapter 59. Conductive Anodic Filament Formation
- Chapter 60. Reliability of Printed Circuit Boards
- Chapter 61. Reliability of Microvia Printed Circuit Boards
- Chapter 62. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
- Chapter 63. Lead-Free Solder Joint Reliability: Fundamentals and Design-for-Reliability Rules
- Chapter 64. Component-to-PWB Reliability: Estimating Solder Joint Reliability and the Impact of Lead-Free Solders
- Part 12 Flexible Circuits
- Chapter 65. Flexible Circuit Applications and Materials
- Chapter 66. Design of Flexible Circuits
- Chapter 67. Manufacturing Flexible Circuits
- Chapter 68. Termination Options for Flexible Circuits
- Chapter 69. Multilayer Flex and Rigid Flex
- Chapter 70. Special Constructions of Flexible Circuits
- Chapter 71. Flexible Circuit Quality Assurance: Principles and Practices
- Appendix. Summary of Key Component, Material, Process, and Design Standards
- Glossary
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- Index
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