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|a 9780071833967
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|a 007183396X
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|a 9780071833950 (print)
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|a (OCoLC)907339759
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|a IN-ChSCO
|b eng
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|a 621.3/81531
|2 23
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| 100 |
1 |
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|a Coombs, Clyde,
|e author.
|
| 245 |
1 |
0 |
|a Printed Circuits Handbook, Seventh Edition /
|c Clyde Coombs, Happy Holden.
|
| 250 |
|
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|a 7th edition.
|
| 264 |
|
1 |
|a New York, N.Y. :
|b McGraw-Hill Education,
|c [2016].
|
| 264 |
|
4 |
|c ?2016.
|
| 300 |
|
|
|a 1 online resource (1504 pages) :
|b 500 illustrations.
|
| 336 |
|
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|a text
|2 rdacontent
|
| 337 |
|
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|a computer
|2 rdamedia
|
| 338 |
|
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|a online resource
|2 rdacarrier
|
| 504 |
|
|
|a Includes bibliographical references and index.
|
| 505 |
0 |
|
|a Cover -- Title Page -- Copyright Page -- Contents -- Contributors -- Preface -- Part 1 Printed Circuit Technology Drivers -- Chapter 1. Electronic Packaging and High-Density Interconnectivity -- Chapter 2. Types of Printed Wiring Boards -- Part 2 Managing the Printed Circuit Supply Chain -- Chapter 3. Basics of Printed Circuit Supply Chain Management -- Chapter 4. Design for Manufacturability -- Chapter 5. Manufacturing Information, Documentation, Formatting, and Exchange -- Chapter 6. Supplier Selection and Qualification -- Chapter 7. Process Control, Monitoring, and Incoming Inspection -- Chapter 8. Product Acceptance and Feedback -- Part 3 Materials -- Chapter 9. Introduction to Base Materials -- Chapter 10. Base Material Components -- Chapter 11. Properties of Base Materials -- Chapter 12. Base Material Performance in PCBs -- Chapter 13. The Impact of Lead-Free Assembly on Base Materials -- Chapter 14. Selecting Base Materials -- Chapter 15. Laminate Qualification and Testing -- Part 4 Engineering and Design -- Chapter 16. Planning for Design, Fabrication, and Assembly -- Chapter 17. Physical Characteristics of the PCB -- Chapter 18. Electronic Design Automation and Printed Circuit Design Tools -- Chapter 19. The PCB Design Process -- Chapter 20. Electrical and Mechanical Design Parameters -- Chapter 21. The Basics of Printed Circuit Board Design -- Chapter 22. Current Carrying Capacity in Printed Circuits -- Chapter 23. PCB Design for Thermal Performance -- Chapter 24. Embedded Components -- Part 5 High- Density Interconnection -- Chapter 25. Introduction to High-Density Interconnection Technology -- Chapter 26. Advanced High-Density Interconnection Technologies -- Part 6 Fabrication -- Chapter 27. CAM Tooling for Fab and Assembly -- Chapter 28. Drilling Processes -- Chapter 29. Precision Interconnect and Laser Drilling -- Chapter 30. Imaging and Automated Optical Inspection -- Chapter 31. Multilayer Materials and Processing -- Chapter 32. Preparing Boards for Plating -- Chapter 33. Electroplating -- Chapter 34. Direct Plating -- Chapter 35. Printed Circuit Board Surface Finishes -- Chapter 36. Solder Mask -- Chapter 37. Etching Process and Technologies -- Chapter 38. Routing and V-Scoring -- Part 7 Bare Board Test -- Chapter 39. Bare Board Test Objectives and Definitions -- Chapter 40. Bare Board Test Methods -- Chapter 41. Bare Board Test Equipment -- Chapter 42. HDI Bare Board Special Testing Methods -- Part 8 Assembly, Soldering Materials, and Processes -- Chapter 43. Assembly Processes -- Chapter 44. Conformal Coating -- Chapter 45. Fluxes and Cleaning -- Chapter 46. Soldering Fundamentals -- Chapter 47. Soldering Materials and Metallurgy -- Chapter 48. Solder Fluxes -- Chapter 49. Soldering Techniques -- Chapter 50. Soldering Repair and Rework -- Part 9 Nonsolder Interconnection -- Chapter 51. Press-Fit Interconnection -- Chapter 52. Pressure-Interconnect Land Grid Array Systems -- Part 10 Quality -- Chapter 53. Acceptability and Quality of Fabricated Boards -- Chapter 54. Acceptability of Printed Circuit Board Assemblies -- Chapter 55. Asssembly Inspection -- Chapter 56. Design for Testing -- Chapter 57. Loaded Board Testing -- Chapter 58. Failure Modes and Effects Analysis -- Part 11 Reliability -- Chapter 59. Conductive Anodic Filament Formation -- Chapter 60. Reliability of Printed Circuit Boards -- Chapter 61. Reliability of Microvia Printed Circuit Boards -- Chapter 62. Component-to-PWB Reliability: The Impact of Design Variables and Lead Free -- Chapter 63. Lead-Free Solder Joint Reliability: Fundamentals and Design-for-Reliability Rules -- Chapter 64. Component-to-PWB Reliability: Estimating Solder Joint Reliability and the Impact of Lead-Free Solders -- Part 12 Flexible Circuits -- Chapter 65. Flexible Circuit Applications and Materials -- Chapter 66. Design of Flexible Circuits -- Chapter 67. Manufacturing Flexible Circuits -- Chapter 68. Termination Options for Flexible Circuits -- Chapter 69. Multilayer Flex and Rigid Flex -- Chapter 70. Special Constructions of Flexible Circuits -- Chapter 71. Flexible Circuit Quality Assurance: Principles and Practices -- Appendix. Summary of Key Component, Material, Process, and Design Standards -- Glossary -- A -- B -- C -- D -- E -- F -- G -- H -- I -- J -- K -- L -- M -- N -- O -- P -- Q -- R -- S -- T -- U -- V -- W -- Index -- A -- B -- C -- D -- E -- F -- G -- H -- I -- J -- K -- L -- M -- N -- O -- P -- Q -- R -- S -- T -- V -- W.
|
| 530 |
|
|
|a Also available in print edition.
|
| 533 |
|
|
|a Electronic reproduction.
|b New York, N.Y. :
|c McGraw Hill,
|d 2016.
|n Mode of access: World Wide Web.
|n System requirements: Web browser.
|n Access may be restricted to users at subscribing institutions.
|
| 538 |
|
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|a Mode of access: Internet via World Wide Web.
|
| 546 |
|
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|a In English.
|
| 588 |
|
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|a Description based on e-Publication PDF.
|
| 650 |
|
0 |
|a Printed circuits.
|
| 650 |
|
0 |
|a Printed circuits
|v Handbooks, manuals, etc.
|
| 655 |
|
0 |
|a Electronic books.
|
| 700 |
1 |
|
|a Holden, Happy,
|e author.
|
| 776 |
1 |
8 |
|i Print version:
|t Printed Circuits Handbook, Seventh Edition,
|d New York, N.Y. : McGraw Hill,
|c [2016],
|z 9780071833950
|
| 856 |
4 |
0 |
|u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071833950
|z Texto completo
|
