3D IC integration and packaging /

A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Lau, John H. (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2016]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Three-dimensional integrated circuits.
Microelectronic packaginga.
Electronic books.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • A. About the Author
  • B. Preface
  • C. Acknowledgments
  • 1. 3D Integration for Semiconductor IC Packaging
  • Introduction
  • 3D Integration
  • 3D IC Packaging
  • 3D Si Integration
  • 3D IC Integration
  • Supply Chains before the TSV Era
  • Supply Chains for the TSV Era?Who Makes the TSV?
  • Supply Chains for the TSV Era?Who Does the MEOL, Assembly, and Test?
  • CMOS Images Sensors with TSVs
  • MEMS with TSVs
  • References
  • 2. Through-Silicon Vias Modeling and Testing
  • Introduction
  • Electrical Modeling of TSVs
  • Thermal Modeling of TSVs
  • Mechanical Modeling and Testing of TSVs
  • References
  • 3. Stress Sensors for Thin-Wafer Handling and Strength Measurement
  • Introduction
  • Design and Fabrication of Piezoresistive Stress Sensors
  • Application of Stress Sensors in Thin-Wafer Handling
  • Application of Stress Sensors in Wafer Bumping
  • Application of Stress Sensors in Drop Test of Embedded Ultrathin Chips
  • References
  • 4. Package Substrate Technologies
  • Introduction
  • Package Substrate with Build-up Layers for Flip Chip 3D IC Integration
  • Coreless Package Substrates
  • Recent Advance of Package Substrate with Build-up Layer
  • References
  • 5. Microbumps: Fabrication, Assembly, and Reliability
  • Introduction
  • Fabrication, Assembly, and Reliability of 25-?m-Pitch Microbumps
  • Fabrication, Assembly, and Reliability of 20-?m-Pitch Microbumps
  • Fabrication, Assembly, and Reliability of 15-?m-Pitch Microbumps
  • References
  • 6. 3D Si Integration
  • Introduction
  • The Electronic Industry
  • Moore's Law and More-Than-Moore
  • The Origin of 3D Integration
  • Overview and Outlook of 3D Si Integration
  • 3D Si Integration Technology Challenges
  • 3D Si Integration EDA Challenges
  • Summary and Recommendations
  • References
  • 7. 2.5D/3D IC Integration
  • Introduction
  • TSV Process for 3D IC Integration
  • The Potential Application of 3D IC Integration
  • Memory-Chip Stacking
  • Wide I/O Memory or Logic-on-Logic
  • Wide I/O DRAM or Hybrid Memory Cube
  • Wide I/O 2 and High Bandwidth Memory
  • Wide I/O Interface (2.5D IC Integration)
  • Thin-Wafer Handling
  • References
  • 8. 3D IC Integration with Passive Interposer
  • Introduction.
  • 3D IC Integration with TSV/RDL Interposer
  • TSV/RDL Interposer with Double-Sided Chip Attachments
  • TSV Interposer with Chips on Both Sides
  • Low-Cost TSH Interposer for 3D IC Integration
  • References
  • 9. Thermal Management of 2.5D/3D IC Integration
  • Introduction
  • Design Philosophy
  • The New Design
  • Equivalent Model for Thermal Analysis
  • Interposer with Chip/Heat Spreader on Its Top Side and Chip on Its Bottom Side
  • Interposer with Chip/Heat Spreader on Its Top Side and Chip/Heat Slug on Its Bottom Side
  • Interposer with Four Chips on Its Top Side with Heat Spreader
  • Thermal Performance between 2.5D and 3D IC Integrations
  • Thermal Management System with TSV Interposers with Embedded Microchannels
  • References
  • 10. Embedded 3D Hybrid Integration
  • Introduction
  • Trends of Optoelectronic Products
  • The Old Design?High-Frequency Data Link on PCB Using Optical Waveguides
  • The Old Design?Embedded Board-Level Optical Interconnects
  • The New Designs
  • An Embedded 3D Hybrid Integration Design Example
  • Semi-Embedded TSV Interposer with Stress Relief Gap
  • References
  • 11. 3D LED and IC Integration
  • Introduction
  • Status and Outlook of Haitz's Law
  • LED Has Come a Long Way!
  • Four Key Segments of LED Products
  • 3D LED and IC Integration
  • 2.5D IC and LED Integration
  • Thermal Management of 3D LED and IC Integration
  • References
  • 12. 3D MEMS and IC Integration
  • Introduction
  • MEMS Packaging
  • Design of 3D MEMS and IC Integration
  • Assembly Process of 3D MEMS and IC Integration
  • Low-Temperature Bonding of 3D MEMS Packaging with Solders
  • Recent Developments in Advanced MEMS Packaging
  • References
  • 13. 3D CMOS Image Sensor and IC Integration
  • Introduction
  • FI-CIS and BI-CIS
  • 3D CIS and IC Stacking
  • 3D CIS and IC Integration
  • Summary and Recommendations
  • References
  • 14. 3D IC Packaging
  • Introduction
  • Chip Stacking by Wirebonding
  • Package-on-Package (PoP)
  • Wafer-Level Packaging
  • Fan-Out eWLP
  • Embedded Panel-Level Packaging
  • Summary and Recommendations
  • References.

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