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3D IC integration and packaging /
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications.
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2016]
|
| Edición: | First edition. |
| Colección: | McGraw-Hill's AccessEngineering.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 010 | |z 2015013446 | ||
| 020 | |a 9780071848060 (print-ISBN) | ||
| 020 | |a 0071848061 (print-ISBN) | ||
| 035 | |a (OCoLC)931502009 | ||
| 040 | |a IN-ChSCO |b eng |e rda | ||
| 041 | 0 | |a eng | |
| 050 | 4 | |a TK7874.893 | |
| 082 | 0 | 4 | |a 621.3815 |2 23 |
| 100 | 1 | |a Lau, John H., |e author. | |
| 245 | 1 | 0 | |a 3D IC integration and packaging / |c John H. Lau. |
| 250 | |a First edition. | ||
| 264 | 1 | |a New York, N.Y. : |b McGraw-Hill Education, |c [2016] | |
| 264 | 4 | |c ?2016 | |
| 300 | |a 1 online resource (xxii, 458 pages) : |b illustrations. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a computer |2 rdamedia | ||
| 338 | |a online resource |2 rdacarrier | ||
| 490 | 1 | |a McGraw-Hill's AccessEngineering | |
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a A. About the Author -- B. Preface -- C. Acknowledgments -- 1. 3D Integration for Semiconductor IC Packaging -- Introduction -- 3D Integration -- 3D IC Packaging -- 3D Si Integration -- 3D IC Integration -- Supply Chains before the TSV Era -- Supply Chains for the TSV Era?Who Makes the TSV? -- Supply Chains for the TSV Era?Who Does the MEOL, Assembly, and Test? -- CMOS Images Sensors with TSVs -- MEMS with TSVs -- References -- 2. Through-Silicon Vias Modeling and Testing -- Introduction -- Electrical Modeling of TSVs -- Thermal Modeling of TSVs -- Mechanical Modeling and Testing of TSVs -- References -- 3. Stress Sensors for Thin-Wafer Handling and Strength Measurement -- Introduction -- Design and Fabrication of Piezoresistive Stress Sensors -- Application of Stress Sensors in Thin-Wafer Handling -- Application of Stress Sensors in Wafer Bumping -- Application of Stress Sensors in Drop Test of Embedded Ultrathin Chips -- References -- 4. Package Substrate Technologies -- Introduction -- Package Substrate with Build-up Layers for Flip Chip 3D IC Integration -- Coreless Package Substrates -- Recent Advance of Package Substrate with Build-up Layer -- References -- 5. Microbumps: Fabrication, Assembly, and Reliability -- Introduction -- Fabrication, Assembly, and Reliability of 25-?m-Pitch Microbumps -- Fabrication, Assembly, and Reliability of 20-?m-Pitch Microbumps -- Fabrication, Assembly, and Reliability of 15-?m-Pitch Microbumps -- References -- 6. 3D Si Integration -- Introduction -- The Electronic Industry -- Moore's Law and More-Than-Moore -- The Origin of 3D Integration -- Overview and Outlook of 3D Si Integration -- 3D Si Integration Technology Challenges -- 3D Si Integration EDA Challenges -- Summary and Recommendations -- References -- 7. 2.5D/3D IC Integration -- Introduction -- TSV Process for 3D IC Integration -- The Potential Application of 3D IC Integration -- Memory-Chip Stacking -- Wide I/O Memory or Logic-on-Logic -- Wide I/O DRAM or Hybrid Memory Cube -- Wide I/O 2 and High Bandwidth Memory -- Wide I/O Interface (2.5D IC Integration) -- Thin-Wafer Handling -- References -- 8. 3D IC Integration with Passive Interposer -- Introduction. | |
| 505 | 0 | |a 3D IC Integration with TSV/RDL Interposer -- TSV/RDL Interposer with Double-Sided Chip Attachments -- TSV Interposer with Chips on Both Sides -- Low-Cost TSH Interposer for 3D IC Integration -- References -- 9. Thermal Management of 2.5D/3D IC Integration -- Introduction -- Design Philosophy -- The New Design -- Equivalent Model for Thermal Analysis -- Interposer with Chip/Heat Spreader on Its Top Side and Chip on Its Bottom Side -- Interposer with Chip/Heat Spreader on Its Top Side and Chip/Heat Slug on Its Bottom Side -- Interposer with Four Chips on Its Top Side with Heat Spreader -- Thermal Performance between 2.5D and 3D IC Integrations -- Thermal Management System with TSV Interposers with Embedded Microchannels -- References -- 10. Embedded 3D Hybrid Integration -- Introduction -- Trends of Optoelectronic Products -- The Old Design?High-Frequency Data Link on PCB Using Optical Waveguides -- The Old Design?Embedded Board-Level Optical Interconnects -- The New Designs -- An Embedded 3D Hybrid Integration Design Example -- Semi-Embedded TSV Interposer with Stress Relief Gap -- References -- 11. 3D LED and IC Integration -- Introduction -- Status and Outlook of Haitz's Law -- LED Has Come a Long Way! -- Four Key Segments of LED Products -- 3D LED and IC Integration -- 2.5D IC and LED Integration -- Thermal Management of 3D LED and IC Integration -- References -- 12. 3D MEMS and IC Integration -- Introduction -- MEMS Packaging -- Design of 3D MEMS and IC Integration -- Assembly Process of 3D MEMS and IC Integration -- Low-Temperature Bonding of 3D MEMS Packaging with Solders -- Recent Developments in Advanced MEMS Packaging -- References -- 13. 3D CMOS Image Sensor and IC Integration -- Introduction -- FI-CIS and BI-CIS -- 3D CIS and IC Stacking -- 3D CIS and IC Integration -- Summary and Recommendations -- References -- 14. 3D IC Packaging -- Introduction -- Chip Stacking by Wirebonding -- Package-on-Package (PoP) -- Wafer-Level Packaging -- Fan-Out eWLP -- Embedded Panel-Level Packaging -- Summary and Recommendations -- References. | |
| 520 | 3 | |a A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications. | |
| 530 | |a Also available in print edition. | ||
| 533 | |a Electronic reproduction. |b New York, N.Y. : |c McGraw Hill, |d 2016. |n Mode of access: World Wide Web. |n System requirements: Web browser. |n Access may be restricted to users at subscribing institutions. | ||
| 538 | |a Mode of access: Internet via World Wide Web. | ||
| 546 | |a In English. | ||
| 588 | |a Description based on cover image and table of contents, viewed on November 23, 2015. | ||
| 650 | 0 | |a Three-dimensional integrated circuits. | |
| 650 | 0 | |a Microelectronic packaginga. | |
| 655 | 0 | |a Electronic books. | |
| 776 | 0 | |i Print version: |t 3D IC integration and packaging. |b First edition. |d New York, N.Y. : McGraw-Hill Education, 2016 |w (OCoLC)898162497 | |
| 830 | 0 | |a McGraw-Hill's AccessEngineering. | |
| 856 | 4 | 0 | |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071848060 |z Texto completo |