Cargando…
3D IC integration and packaging /
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications.
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2016]
|
| Edición: | First edition. |
| Colección: | McGraw-Hill's AccessEngineering.
|
| Temas: | |
| Acceso en línea: | Texto completo |
| Sumario: | A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications. |
|---|---|
| Descripción Física: | 1 online resource (xxii, 458 pages) : illustrations. Also available in print edition. |
| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 9780071848060 (print-ISBN) 0071848061 (print-ISBN) |