Cargando…

Wire bonding in microelectronics

Detalles Bibliográficos
Clasificación:	Libro Electrónico
Autor principal:	Harman, George G.
Formato:	Electrónico eBook
Idioma:	Inglés
Publicado:	New York : McGraw-Hill, [2010]
Edición:	3rd ed.
Colección:	McGraw-Hill's AccessEngineering.
Temas:	Wire bonding (Electronic packaging) > Production control. Electronic packaging > Reliability. Electronic packaging > Defects. Semiconductors > Failures. Electronic books. Internet resources.
Acceso en línea:	Texto completo

Ejemplares similares

Specification for thermal spray feedstock--wire and rods /
Publicado: (2012)

Specification for thermal spray feedstock--solid and composite wire and ceramic rods /
Publicado: (2002)

Fundamentals of microsystems packaging /
Publicado: (2001)

Electronic materials and processes handbook
Publicado: (2003)

Semiconductor packaging materials interaction and reliability /
Publicado: (2011)

Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials /
Publicado: (2003)

Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
por: Lee, Ning-Cheng
Publicado: (2002)

Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /
por: Lee, Ning-Cheng
Publicado: (2002)

Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /
Publicado: (2018)

Electronic packaging interconnect technology : Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan /
Publicado: (2018)

Electronic packaging science and technology /
por: Tu, K. N. (King-Ning), 1937-, et al.
Publicado: (2022)

Lead-free solder interconnect reliability /
Publicado: (2005)

Lead-free solder interconnect reliability /
Publicado: (2005)

Lead-free solder interconnect reliability /
Publicado: (2005)

Microchip fabrication : a practical guide to semiconductor processing
por: Van Zant, Peter
Publicado: (2004)

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Publicado: (2014)

Modeling, analysis, design, and tests for electronics packaging beyond Moore /
por: Zhang, Hengyun, et al.
Publicado: (2020)

Packaging and pack engineering /
Publicado: (1972)

Empaques, envases y embalajes : el producto y su recipiente /
por: Mendoza Robledo, Jaime
Publicado: (2018)

Lead-free soldering process development and reliability
por: BATH
Publicado: (2019)

Materials for high-density electronic packaging and interconnection.
Publicado: (1990)

Characterization of integrated circuit packaging materials /
Publicado: (1993)

Encyclopedia of thermal packaging.
Publicado: (2014)

Adhesives technology for electronic applications : materials, processing, reliability /
por: Licari, James J., 1930-
Publicado: (2011)

Encyclopedia of thermal packaging.
Publicado: (2013)

Packaging technology : fundamentals, materials and processes /
Publicado: (2012)

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010 /
Publicado: (2011)

Microvias : for low-cost, high-density interconnects /
por: Lau, John H.
Publicado: (2001)

Components, packaging and manufacturing technology II : selected, peer reviewed papers from the 2013 3rd International Conference on Packaging and Manufacturing Technology (ICCPMT 2013), December 31, 2013 - January 2, 2014, Brisbane Australia /
Publicado: (2014)

Modeling, analysis, design, and tests for electronics packaging beyond Moore /
por: Zhang, Hengyun, et al.
Publicado: (2020)

Materials for High-Density Electronic Packaging and Interconnection.
por: Packaging, Committee on Materials for High-Density Electronic
Publicado: (1900)

Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies /
por: Martin, Perry L.
Publicado: (2000)

Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging /
Publicado: (2006)

Packaging technology : fundamentals, materials and processes /
Publicado: (2012)

Packaging technology : fundamentals, materials and processes /
Publicado: (2012)

Packaging technology : fundamentals, materials and processes /
Publicado: (2012)

Green Printing and Packaging Materials : Selected, peer reviewed papers from the 2011 China Academic Conference on Green Printing and Packaging Materials, August 20-23, 2011, Harbin, China /
Publicado: (2011)

Components, packaging and manufacturing technology : selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology, Sanya, China, December 9-10, 2010 /
Publicado: (2011)

Advances in meat, poultry and seafood packaging /
Publicado: (2012)

Heat transfer : thermal management of electronics /
por: Shabany, Younes
Publicado: (2010)

Cannot write session to /tmp/vufind_sessions/sess_jde4mk0g95djtdlj6g532ur29p