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100830s2010 nyua fob 001 0 eng d |
| 010 |
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|z 2010287045
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| 020 |
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|a 9780071476232
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| 020 |
|
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|a 9780071703345
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| 020 |
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|a 9780071476232
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| 050 |
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4 |
|a TK7836
|b .H366 2010
|
| 082 |
0 |
4 |
|a 621.381
|2 22
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| 100 |
1 |
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|a Harman, George G.
|
| 245 |
1 |
0 |
|a Wire bonding in microelectronics
|h [electronic resource] /
|c George G. Harmon.
|
| 250 |
|
|
|a 3rd ed.
|
| 260 |
|
|
|a New York :
|b McGraw-Hill,
|c [2010]
|
| 300 |
|
|
|a 1 electronic text (xx, 426 p.) :
|b ill.
|
| 490 |
1 |
|
|a McGraw-Hill's AccessEngineering
|
| 500 |
|
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|a Print version c2010.
|
| 500 |
|
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|a Previous edition: 1997; first published as: Reliability and yield problems of wire bonding in microelectronics. 1989.
|
| 504 |
|
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|a Includes bibliographical references and index.
|
| 530 |
|
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|a Also issued in print and PDF versions.
|
| 588 |
|
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|a Description based on cover image and table of contents, viewed on August 28, 2010.
|
| 650 |
|
0 |
|a Wire bonding (Electronic packaging)
|x Production control.
|
| 650 |
|
0 |
|a Electronic packaging
|x Reliability.
|
| 650 |
|
0 |
|a Electronic packaging
|x Defects.
|
| 650 |
|
0 |
|a Semiconductors
|x Failures.
|
| 655 |
|
0 |
|a Electronic books.
|
| 655 |
|
0 |
|a Internet resources.
|
| 700 |
1 |
|
|a Harman, George G.
|t Reliability and yield problems of wire bonding in microelectronics.
|
| 740 |
4 |
2 |
|a The technical introduction to the third edition.
|
| 740 |
0 |
2 |
|a Ultrasonic bonding systems and technologies, including a description of the ultrasonic wire bonding mechanism.
|
| 740 |
0 |
2 |
|a Bonding wire metallurgy and characteristics that can affect bonding, reliability, or testing.
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| 740 |
0 |
2 |
|a Wire bond testing.
|
| 740 |
0 |
2 |
|a Gold-aluminum intermetallic compounds and other metallic interface reactions in wire bonding.
|
| 740 |
0 |
2 |
|a Introduction to plating, section a (gold) and section b (nickel-based) bond pad technology and reliability.
|
| 740 |
0 |
2 |
|a Cleaning to improve bondability and reliability.
|
| 740 |
0 |
2 |
|a Mechanical problems in wire bonding.
|
| 740 |
0 |
2 |
|a Advanced and specialized wire bonding technologies: (including high yield, fine pitch, pcbs, soft substrates, extreme temperature wire bonding and specialized looping).
|
| 740 |
3 |
2 |
|a An overview of the materials and material science of copper, low-k devices that affect bonding and packaging.
|
| 740 |
0 |
2 |
|a Wire bonding process modeling and simulation.
|
| 830 |
|
0 |
|a McGraw-Hill's AccessEngineering.
|
| 856 |
4 |
0 |
|u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071476232
|z Texto completo
|
| 997 |
|
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|a (c)2010 Cassidy Cataloguing Services, Inc.
|
