Wire bonding in microelectronics

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Harman, George G.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York : McGraw-Hill, [2010]
Edición:3rd ed.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Wire bonding (Electronic packaging) > Production control.
Electronic packaging > Reliability.
Electronic packaging > Defects.
Semiconductors > Failures.
Electronic books.
Internet resources.
Acceso en línea:Texto completo
Descripción
Notas:Print version c2010.
Previous edition: 1997; first published as: Reliability and yield problems of wire bonding in microelectronics. 1989.
Descripción Física:1 electronic text (xx, 426 p.) : ill.
Also issued in print and PDF versions.
Bibliografía:Includes bibliographical references and index.
ISBN:9780071476232
9780071703345

Ejemplares similares