Advanced MEMS packaging /

Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Lau, John H., Lee, Chengkuo, Premachandran, C. S., Aibin, Yu
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2010]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Microelectromechanical systems.
Microelectronic packaging.
Electronic books.
Acceso en línea:Texto completo

MARC

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010 |z  2009040456 
020 |a 0071741836 
020 |a 9780071626231 
035 |a (OCoLC)557051537 
040 |a IN-ChSCO  |b eng  |e rda 
041 0 |a eng 
050 4 |a TK7875 
082 0 4 |a 621.381/046  |2 22 
245 0 0 |a Advanced MEMS packaging /  |c John H. Lau . [et al.]. 
246 3 |a Advanced microelectromechanical systems packaging 
250 |a First edition. 
264 1 |a New York, N.Y. :  |b McGraw-Hill Education,  |c [2010] 
264 4 |c ?2010 
300 |a 1 online resource (xxiii, 552 pages) :  |b illustrations. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c2010. 
504 |a Includes bibliographical references and index. 
505 0 |a Introduction to MEMS -- Advanced MEMS packaging -- Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices. 
520 0 |a Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices. 
530 |a Also available in print edition. 
533 |a Electronic reproduction.  |b New York, N.Y. :  |c McGraw Hill,   |d 2010.  |n Mode of access: World Wide Web.  |n System requirements: Web browser.  |n Access may be restricted to users at subscribing institutions. 
538 |a Mode of access: Internet via World Wide Web. 
546 |a In English. 
588 |a Description based on cover image and table of contents, viewed on February 08, 2010. 
650 0 |a Microelectromechanical systems. 
650 0 |a Microelectronic packaging. 
655 0 |a Electronic books. 
700 1 |a Lau, John H. 
700 1 |a Lee, Chengkuo. 
700 1 |a Premachandran, C. S. 
700 1 |a Aibin, Yu. 
740 0 2 |a Introduction to MEMS. 
740 0 2 |a Advanced MEMS packaging. 
740 0 2 |a Enabling technologies for advanced MEMS packaging. 
740 0 2 |a Advanced MEMS wafer-level packaging. 
740 0 2 |a Optical MEMS packaging: communications. 
740 0 2 |a Optical MEMS packaging: bubble switch. 
740 0 2 |a Optical MEMS: microbolometer packaging. 
740 0 2 |a Bio- MEMS packaging. 
740 0 2 |a Biosensor packaging. 
740 0 2 |a Accelerometer packaging. 
740 0 2 |a Radio frequency MEMS switches. 
740 0 2 |a RF MEMS tunable capacitors and tunable band-pass filters. 
740 0 2 |a Advanced packaging of RF MEMS devices. 
776 0 |i Print version:   |t Advanced MEMS packaging.  |b First edition.  |d New York, N.Y. : McGraw-Hill Education, 2010  |w (OCoLC)277205716 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071626231  |z Texto completo 
997 |a (c)2010 Cassidy Cataloguing Services, Inc. 

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