Advanced MEMS packaging /

Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Lau, John H., Lee, Chengkuo, Premachandran, C. S., Aibin, Yu
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2010]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Microelectromechanical systems.
Microelectronic packaging.
Electronic books.
Acceso en línea:Texto completo
Descripción
Sumario:Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.
Notas:Print version c2010.
Descripción Física:1 online resource (xxiii, 552 pages) : illustrations.
Also available in print edition.
Bibliografía:Includes bibliographical references and index.
ISBN:0071741836
9780071626231

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