Introduction to system-on-package (SOP) : miniaturization of the entire system /

"System-on-Package (SOP) is an emerging system technology that goes beyond System-on-Chip (SOC) and System-in-Package (SIP) and forms the basis of all emerging digital convergent electronic and bioelectric systems. This book on SOP shows designers how this revolutionary new packaging technology...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Tummala, Rao R., 1942- (Autor)
Otros Autores: Swaminathan, Madhavan, Bandyopadhyay, Tapobrata, Mehendale, Mahesh, Rao, Jagdish, Lee, Baik-Woo, Yoon, Chong K., Brown, Kenneth M., Engin, A. Ege, Govind, Vinu, Bavisi, Amit, Papapolymerou, John, Tentzeris, Manos, Laskar, Joy, Bhattacharya, Swapan, Chang, Gee-Kung, Gaylord, Thomas, Vallalaz, Ricardo, Guidotti, Daniel, Chen, Ray T., Sundaram, Venky, Liu, Fuhan, Krishnan, Ganesh, White, George, Kohl, Paul, Raj, P. Markondeya, Pucha, Raghuram V., Qu, Jianmin, Sitaraman, Suresh K., Monajemi, Pejman, Ayazi, Farrokh, Sparks, Douglas, Zhang, Zhuqing, Li , Y., Wong, C. P., Joshi, Y., Jha, Gopal C., Patterson, M., Dutta, P., Akbay, S. S., Keezer, D., Chatterjee, A., Janagama, Dasharathan G., Liu, Jin, Iyer, Mahadevan K.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2008]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
Electronic books.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Introduction to system-on-chip (SOC)
  • Stacked ICs and packages (SIP)
  • Mixed-signal (SOP) design
  • Radio frequency system-on-package (RF SOP)
  • Integrated chip-to-chip optoelectronic SOP
  • SOP substrate with multilayer wiring and thin-film embedded components
  • Mixed-signal reliability
  • MEMS packaging
  • Wafer-level SOP
  • Thermal SOP
  • Electrical test of SOP modules and systems
  • Biosensor SOP.

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