Introduction to system-on-package (SOP) : miniaturization of the entire system /

"System-on-Package (SOP) is an emerging system technology that goes beyond System-on-Chip (SOC) and System-in-Package (SIP) and forms the basis of all emerging digital convergent electronic and bioelectric systems. This book on SOP shows designers how this revolutionary new packaging technology...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Tummala, Rao R., 1942- (Autor)
Otros Autores: Swaminathan, Madhavan, Bandyopadhyay, Tapobrata, Mehendale, Mahesh, Rao, Jagdish, Lee, Baik-Woo, Yoon, Chong K., Brown, Kenneth M., Engin, A. Ege, Govind, Vinu, Bavisi, Amit, Papapolymerou, John, Tentzeris, Manos, Laskar, Joy, Bhattacharya, Swapan, Chang, Gee-Kung, Gaylord, Thomas, Vallalaz, Ricardo, Guidotti, Daniel, Chen, Ray T., Sundaram, Venky, Liu, Fuhan, Krishnan, Ganesh, White, George, Kohl, Paul, Raj, P. Markondeya, Pucha, Raghuram V., Qu, Jianmin, Sitaraman, Suresh K., Monajemi, Pejman, Ayazi, Farrokh, Sparks, Douglas, Zhang, Zhuqing, Li , Y., Wong, C. P., Joshi, Y., Jha, Gopal C., Patterson, M., Dutta, P., Akbay, S. S., Keezer, D., Chatterjee, A., Janagama, Dasharathan G., Liu, Jin, Iyer, Mahadevan K.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2008]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
Electronic books.
Acceso en línea:Texto completo

MARC

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020 |a 0071603158 
020 |a 0071459065 (print-ISBN) 
020 |a 9780071459068 
035 |a (OCoLC)231688721 
040 |a IN-ChSCO  |b eng  |e rda 
041 0 |a eng 
050 4 |a TK7870.15 
082 0 4 |a 621.381/046  |2 22 
100 1 |a Tummala, Rao R.,  |d 1942-,  |e author. 
245 1 0 |a Introduction to system-on-package (SOP) :  |b miniaturization of the entire system /  |c Rao R. Tummala, Madhavan Swaminathan. 
246 1 |i Online index title:  |a System on package: miniaturization of the entire system 
250 |a First edition. 
264 1 |a New York, N.Y. :  |b McGraw-Hill Education,  |c [2008] 
264 4 |c ?2008 
300 |a 1 online resource (xx, 785 pages) :  |b illustrations. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c2008. 
504 |a Includes bibliographical references and index. 
505 0 |a Introduction to system-on-chip (SOC) -- Stacked ICs and packages (SIP) -- Mixed-signal (SOP) design -- Radio frequency system-on-package (RF SOP) -- Integrated chip-to-chip optoelectronic SOP -- SOP substrate with multilayer wiring and thin-film embedded components -- Mixed-signal reliability -- MEMS packaging -- Wafer-level SOP -- Thermal SOP -- Electrical test of SOP modules and systems -- Biosensor SOP. 
520 0 |a "System-on-Package (SOP) is an emerging system technology that goes beyond System-on-Chip (SOC) and System-in-Package (SIP) and forms the basis of all emerging digital convergent electronic and bioelectric systems. This book on SOP shows designers how this revolutionary new packaging technology answers a wide range of pressing digital convergence challenges."--Jacket. 
530 |a Also available in print edition. 
533 |a Electronic reproduction.  |b New York, N.Y. :  |c McGraw Hill,   |d 2008.  |n Mode of access: World Wide Web.  |n System requirements: Web browser.  |n Access may be restricted to users at subscribing institutions. 
538 |a Mode of access: Internet via World Wide Web. 
546 |a In English. 
588 |a Description based on cover image and table of contents, viewed on October 21, 2008. 
650 0 |a Multichip modules (Microelectronics)  |x Design and construction. 
650 0 |a Microelectronic packaging. 
655 0 |a Electronic books. 
700 1 |a Swaminathan, Madhavan. 
700 1 |a Bandyopadhyay, Tapobrata. 
700 1 |a Mehendale, Mahesh. 
700 1 |a Rao, Jagdish. 
700 1 |a Lee, Baik-Woo. 
700 1 |a Yoon, Chong K. 
700 1 |a Brown, Kenneth M. 
700 1 |a Engin, A. Ege. 
700 1 |a Govind, Vinu. 
700 1 |a Bavisi, Amit. 
700 1 |a Papapolymerou, John. 
700 1 |a Tentzeris, Manos. 
700 1 |a Laskar, Joy. 
700 1 |a Bhattacharya, Swapan. 
700 1 |a Chang, Gee-Kung. 
700 1 |a Gaylord, Thomas. 
700 1 |a Vallalaz, Ricardo. 
700 1 |a Guidotti, Daniel. 
700 1 |a Chen, Ray T. 
700 1 |a Sundaram, Venky. 
700 1 |a Liu, Fuhan. 
700 1 |a Krishnan, Ganesh. 
700 1 |a White, George. 
700 1 |a Kohl, Paul. 
700 1 |a Raj, P. Markondeya. 
700 1 |a Pucha, Raghuram V. 
700 1 |a Qu, Jianmin. 
700 1 |a Sitaraman, Suresh K. 
700 1 |a Monajemi, Pejman. 
700 1 |a Ayazi, Farrokh. 
700 1 |a Sparks, Douglas. 
700 1 |a Zhang, Zhuqing. 
700 1 |a Li , Y. 
700 1 |a Wong, C. P. 
700 1 |a Joshi, Y. 
700 1 |a Jha, Gopal C. 
700 1 |a Patterson, M. 
700 1 |a Dutta, P. 
700 1 |a Akbay, S. S. 
700 1 |a Keezer, D. 
700 1 |a Chatterjee, A. 
700 1 |a Janagama, Dasharathan G. 
700 1 |a Liu, Jin. 
700 1 |a Iyer, Mahadevan K. 
740 0 2 |a Introduction to the system-on-package (SOP) technology. 
740 0 2 |a Introduction to system-on-chip (SOC). 
740 0 2 |a Stacked ICS and packages (SIP). 
740 0 2 |a Mixed-signal (SOP) design. 
740 0 2 |a Radio frequency systemon-package (RF SOP). 
740 0 2 |a Integrated chip-to-chip optoelectronic SOP. 
740 0 2 |a SOP substrate with multilayer wiring and thin-film embedded components. 
740 0 2 |a Mixed-signal (SOP) reliability. 
740 0 2 |a MEMS packaging. 
740 0 2 |a Wafer-level SOP. 
740 0 2 |a Thermal SOP. 
740 0 2 |a Electrical test of SOP modules and systems. 
740 0 2 |a Biosensor SOP. 
776 0 |i Print version:   |t Introduction to system-on-package (SOP) : miniaturization of the entire system.  |b First edition.  |d New York, N.Y. : McGraw-Hill Education, 2008  |w (OCoLC)226291849 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071459068  |z Texto completo 
997 |a (c)2008 Cassidy Cataloguing Services, Inc. 

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