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Printed circuits handbook, sixth edition
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York :
McGraw-Hill,
[2008]
|
| Edición: | 6th ed. |
| Colección: | McGraw-Hill's AccessEngineering.
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Legislation and impact on printed circuits / Gary M. Freedman
- Electronic packaging and high-density interconnectivity / Clyde F. Coombs Jr.
- Semiconductor packaging technology / John W. Stafford
- Advanced component packaging / Tarak A. Railkar
- Types of printed wiring boards / Dr. Hayao Nakahara
- Introduction to base materials / Edward J. Kelley
- Base material components / Edward J. Kelley
- Properties of base materials / Edward J. Kelley
- Base materials performance issues / Edward J. Kelley
- Impact of lead-free assembly on base materials / Edward J. Kelley
- Selecting base materials for lead-free assembly applications / Edward J. Kelley
- Laminate qualification and testing / Michael Roesch
- Physical characteristics of the PCB / Lee W. Ritchey
- PCB design process / Lee W. Ritchey
- Electrical and mechanical design parameters / Ralph J. Hersey, Jr.
- Current carrying capacity in printed circuits / Mike Jouppi
- PCB design for thermal performance / Darvin Edwards
- Information formating and exchange / Bini Elhanan
- Planning for design, fabrication, and assembly / Happy T. Holden
- Manufacturing information, documentation, and transfer including cam tooling for fab and assembly / Happy T. Holden
- Embedded components / Dennis Fritz
- Introduction to high-density interconnection (HDI) technology / Happy T. Holden
- Advanced high-density interconnection (HDI) technologies / Happy T. Holden
- Drilling processes / Hans Vandervelde
- Precision interconnect drilling / Terry Haney
- Imaging / Brian F. Conaghan
- Multilayer materials and processing / C. D. (Don) Dupriest
- Preparing boards for plating / Jim Watkowski
- Electroplating / Jim Watkowski
- Direct plating / Dr. Hayao Nakahara
- PWB manufacture using fully electroless copper / Dr. Hayao Nakahara
- Printed circuit board surface finishes / Don Cullen
- Solder mask / David A. Vaughan
- Etching process and technologies / Marshall I. Gurian
- Machining and routing / Gary Roper
- Bare board test objectives and definitions / David J. Wilkie
- Bare board test methods / David J. Wilkie
- Bare board test equipment / David J. Wilkie
- HDI bare board special testing methods / David J. Wilkie
- Assembly processes / Paul T. Vianco
- Conformal coating / Jody Byram
- Solderability: incoming inspection and wetting balance technique / Gerard O?Brien
- Fluxes and cleaning / Gregory C. Munie
- Soldering fundamentals / Gary M. Freedman
- Soldering materials and metallurgy / Gary M. Freedman
- Solder fluxes / Gary M. Freedman
- Soldering techniques / Gary M. Freedman
- Soldering repair and rework / Gary M. Freedman
- Press-fit interconnection / Gary M. Freedman
- Land grid array interconnect / Gary M. Freedman
- Acceptability and quality of fabricated boards / Robert (Bob) Neves
- Acceptability of printed circuit board assemblies / Mel Parrish
- Assembly inspection / Stacy Kalisz Johnson
- Design for testing / Kenneth P. Parker
- Loaded board testing / Kenneth P. Parker
- Conductive anodic filament formation / Dr. Laura J. Turbini
- Reliability of printed circuit assemblies / Judith Glazer
- Component-to-PWB reliability-the impact of design variables and lead free / Mudasir Ahmad
- Component-to-PWB reliability: estimating solder joint reliability and the impact of lead-free solders / Mudasir Ahmad
- Process waste minimization and treatment / Joyce M. Avery
- Flexible circuit applications and materials / Dominique K. Numakura
- Design of flexible circuits / Dominique K. Numakura
- Manufacturing of flexible circuits / Dominique K. Numakura
- Termination of flexible circuits / Dominique K. Numakura
- Multilayer flex and rigid/flex / Dominique K. Numakura
- Special constructions of flexible circuits / Dominique K. Numakura
- Quality assurance of flexible circuits / Dominique K. Numakura.