Printed circuits handbook, sixth edition

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Coombs, Clyde F.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York : McGraw-Hill, [2008]
Edición:6th ed.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Printed circuits.
Electronic books.
Internet resources.
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000 a 4500
001 MGH_AEccn00219140
005 20071213182034.0
006 m f d
007 cr cn ---uuauu
008 071213s2008 nyua fobf 001 0 eng d
010 |z  2007032471 
020 |a 9780071467346 
035 |a (Sirsi) a219140 
050 4 |a TK7868.P7  |b P76 2008 
082 0 4 |a 621.3815/31  |2 22 
245 0 0 |a Printed circuits handbook, sixth edition  |h [electronic resource] /  |c Clyde F. Coombs, Jr., editor-in-chief. 
246 3 0 |a Printed circuits handbook 
250 |a 6th ed. 
260 |a New York :  |b McGraw-Hill,  |c [2008] 
300 |a 1 electronic text (1 v. (various pagings)) :  |b ill. 
490 1 |a McGraw-Hill handbooks 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c2008. 
504 |a Includes bibliographical references and index. 
505 0 0 |t Legislation and impact on printed circuits /  |r Gary M. Freedman --  |t Electronic packaging and high-density interconnectivity /  |r Clyde F. Coombs Jr. --  |t Semiconductor packaging technology /  |r John W. Stafford --  |t Advanced component packaging /  |r Tarak A. Railkar --  |t Types of printed wiring boards /  |r Dr. Hayao Nakahara --  |t Introduction to base materials /  |r Edward J. Kelley --  |t Base material components /  |r Edward J. Kelley --  |t Properties of base materials /  |r Edward J. Kelley --  |t Base materials performance issues /  |r Edward J. Kelley --  |t Impact of lead-free assembly on base materials /  |r Edward J. Kelley --  |t Selecting base materials for lead-free assembly applications /  |r Edward J. Kelley --  |t Laminate qualification and testing /  |r Michael Roesch --  |t Physical characteristics of the PCB /  |r Lee W. Ritchey --  |t PCB design process /  |r Lee W. Ritchey --  |t Electrical and mechanical design parameters /  |r Ralph J. Hersey, Jr. --  |t Current carrying capacity in printed circuits /  |r Mike Jouppi --  |t PCB design for thermal performance /  |r Darvin Edwards --  |t Information formating and exchange /  |r Bini Elhanan --  |t Planning for design, fabrication, and assembly /  |r Happy T. Holden --  |t Manufacturing information, documentation, and transfer including cam tooling for fab and assembly /  |r Happy T. Holden --  |t Embedded components /  |r Dennis Fritz --  |t Introduction to high-density interconnection (HDI) technology /  |r Happy T. Holden --  |t Advanced high-density interconnection (HDI) technologies /  |r Happy T. Holden --  |t Drilling processes /  |r Hans Vandervelde --  |t Precision interconnect drilling /  |r Terry Haney --  |t Imaging /  |r Brian F. Conaghan --  |t Multilayer materials and processing /  |r C. D. (Don) Dupriest --  |t Preparing boards for plating /  |r Jim Watkowski --  |t Electroplating /  |r Jim Watkowski --  |t Direct plating /  |r Dr. Hayao Nakahara --  |t PWB manufacture using fully electroless copper /  |r Dr. Hayao Nakahara --  |t Printed circuit board surface finishes /  |r Don Cullen --  |t Solder mask /  |r David A. Vaughan --  |t Etching process and technologies /  |r Marshall I. Gurian --  |t Machining and routing /  |r Gary Roper --  |t Bare board test objectives and definitions /  |r David J. Wilkie --  |t Bare board test methods /  |r David J. Wilkie --  |t Bare board test equipment /  |r David J. Wilkie --  |t HDI bare board special testing methods /  |r David J. Wilkie --  |t Assembly processes /  |r Paul T. Vianco -- 
505 0 0 |t Conformal coating /  |r Jody Byram --  |t Solderability: incoming inspection and wetting balance technique /  |r Gerard O?Brien --  |t Fluxes and cleaning /  |r Gregory C. Munie --  |t Soldering fundamentals /  |r Gary M. Freedman --  |t Soldering materials and metallurgy /  |r Gary M. Freedman --  |t Solder fluxes /  |r Gary M. Freedman --  |t Soldering techniques /  |r Gary M. Freedman --  |t Soldering repair and rework /  |r Gary M. Freedman --  |t Press-fit interconnection /  |r Gary M. Freedman --  |t Land grid array interconnect /  |r Gary M. Freedman --  |t Acceptability and quality of fabricated boards /  |r Robert (Bob) Neves --  |t Acceptability of printed circuit board assemblies /  |r Mel Parrish --  |t Assembly inspection /  |r Stacy Kalisz Johnson --  |t Design for testing /  |r Kenneth P. Parker --  |t Loaded board testing /  |r Kenneth P. Parker --  |t Conductive anodic filament formation /  |r Dr. Laura J. Turbini --  |t Reliability of printed circuit assemblies /  |r Judith Glazer --  |t Component-to-PWB reliability-the impact of design variables and lead free /  |r Mudasir Ahmad --  |t Component-to-PWB reliability: estimating solder joint reliability and the impact of lead-free solders /  |r Mudasir Ahmad --  |t Process waste minimization and treatment /  |r Joyce M. Avery --  |t Flexible circuit applications and materials /  |r Dominique K. Numakura --  |t Design of flexible circuits /  |r Dominique K. Numakura --  |t Manufacturing of flexible circuits /  |r Dominique K. Numakura --  |t Termination of flexible circuits /  |r Dominique K. Numakura --  |t Multilayer flex and rigid/flex /  |r Dominique K. Numakura --  |t Special constructions of flexible circuits /  |r Dominique K. Numakura --  |t Quality assurance of flexible circuits /  |r Dominique K. Numakura. 
530 |a Also issued in print and PDF version. 
588 |a Description based on cover image and table of contents, viewed on June 3, 2011. 
650 0 |a Printed circuits. 
655 0 |a Electronic books. 
655 0 |a Internet resources. 
700 1 |a Coombs, Clyde F. 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071467346  |z Texto completo 
997 |a (c)2007 Cassidy Cataloguing Services, Inc. 

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