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Semiconductor manufacturing handbook /

Annotation WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged w...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: IDC Corporation
Otros Autores: Geng, Hwaiyu, Zhou, Lin, Park, Ilsun, Ravi, K. V., Rathore, Hazara S., Chanda, Kaushik, Ren, L. P., Tu, King N., Coumou, David J., Biltoft, Peter, Howard, Charles, Mack, Chris A., Graf, Michael, Zhang, Peng, Lai, Shouliang, Solzbacher, Florian, McInerney, Edward J., Ramdani, Jamal, Vaccari, Giovanni, Ritzdorf, Tom, Klocke, John, Dyer, Timothy S., Machamer, Andrew, Blair, Donald W., Arai, Kazuhisa, Kobayashi, Yoshikazu, Otani, Hideaki, Tonnies, Dietrich, Topper, Michael, Wang, Zhong L., Huff, Michael A., Liu, David N., Curcie, Wayne D., Sweeney, Joseph D., Cox, James C., Cavicchi, Kristin, Barsness, Dan, Gould, Charles K., Albrecht, David J., Li, Bo, Carriker, Wayne, Haris, Clint, Peltinov, Ram, Menaker, Mina, Scibilia, Bruno, Altis, Yoan Dupret, McCafferty, Robert H., Davis, Brett J., Trammell, Steven R., Pavlotsky, Richard V., Beck, Stephen C., Gendreau, Michael, Amick, Hal, Levit, Larry, Muller, Chris, Kochevar, Steven, Gromala, Jerry, Pinkowski, Richard E.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2005]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Acceso en línea:Texto completo

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010 |z  2005045580 
020 |a 0071468153 
020 |a 0071445595 (print-ISBN) 
020 |a 9780071445597 
035 |a (OCoLC)61400804 
040 |a IN-ChSCO  |b eng  |e rda 
041 0 |a eng 
050 4 |a TK7871.85 
082 0 4 |a 621.3815/2  |2 22 
245 0 0 |a Semiconductor manufacturing handbook /  |c edited by Hwaiyu Geng. 
250 |a First edition. 
264 1 |a New York, N.Y. :  |b McGraw-Hill Education,  |c [2005] 
264 4 |c ?2005 
300 |a 1 online resource (912 pages) :  |b illustrations. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c2005. 
504 |a Includes bibliographical references and index. 
505 0 |a Pt. 1. Semiconductor fundamentals and basic materials -- pt. 2. Wafer processing -- pt. 3. Final manufacturing -- pt. 4. Nanotechnology, EMS, and FPD -- pt. 5. Gases and chemicals -- pt. 6. Fab yield, operations, and facilities. 
520 0 |a Annotation WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The "Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the "Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * IonImplantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND C. Annotation This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines. 
530 |a Also available in print edition. 
533 |a Electronic reproduction.  |b New York, N.Y. :  |c McGraw Hill,   |d 2005.  |n Mode of access: World Wide Web.  |n System requirements: Web browser.  |n Access may be restricted to users at subscribing institutions. 
538 |a Mode of access: Internet via World Wide Web. 
545 0 |a Contributor biographical information:  |u http://www.loc.gov/catdir/enhancements/fy0624/2005045580-b.html 
546 |a In English. 
588 |a Description based on cover image and table of contents, viewed on May 4, 2007. 
650 0 |a Semiconductors  |x Design and construction. 
650 0 |a Integrated circuits  |x Design and construction. 
650 0 |a Semiconductors  |x Materials. 
650 0 |a Integrated circuits  |x Reliability. 
650 0 |a Dielectrics. 
650 0 |a Silicides. 
650 0 |a Plasma engineering. 
650 0 |a Process control. 
650 0 |a Vacuum techology. 
650 0 |a Integrated circuits  |x Masks. 
650 0 |a Microlithography. 
650 0 |a Ion implantation. 
650 0 |a Rapid thermal process. 
650 0 |a Plasma etching. 
650 0 |a Etching. 
650 0 |a Physical vapor deposition. 
650 0 |a Chemical vapor deposition. 
650 0 |a Epitaxy. 
650 0 |a Electrolytic polishing. 
650 0 |a Semiconductors  |x Polishing. 
650 0 |a Semiconductors  |x Cleaning. 
650 0 |a Grinding and polishing. 
650 0 |a Microelectronic packaging. 
650 0 |a Electronic packaging. 
650 0 |a Nanotechnology. 
650 0 |a Microfabrication. 
650 0 |a Microelectromechanical systems. 
650 0 |a Flat panel displays. 
650 0 |a Gases. 
650 0 |a Waste gases  |x Purification. 
650 0 |a Hydraulic conveying. 
650 0 |a Slurry pipelines. 
650 0 |a Chemical plants  |x Waste disposal. 
650 0 |a Water-supply engineering. 
650 0 |a Materials handling. 
650 0 |a Metrology. 
650 0 |a Six sigma (Quality control standard) 
650 0 |a Semiconductor industry  |x Environmental aspects. 
650 0 |a Semiconductor industry  |x Health aspects. 
650 0 |a Semiconductor industry  |x Safety measures. 
650 0 |a Clean rooms  |x Design and construction. 
650 0 |a Vibration. 
650 0 |a Noise control. 
650 0 |a Static eliminators. 
650 0 |a Electrostatics. 
650 0 |a Airborne infection. 
650 0 |a Air  |x Pollution. 
650 0 |a Sewage  |x Purification  |x Neutralization. 
655 0 |a Electronic books. 
700 1 |a Geng, Hwaiyu. 
700 1 |a Zhou, Lin. 
700 1 |a Park, Ilsun. 
700 1 |a Ravi, K. V. 
700 1 |a Rathore, Hazara S. 
700 1 |a Chanda, Kaushik. 
700 1 |a Ren, L. P. 
700 1 |a Tu, King N. 
700 1 |a Coumou, David J. 
700 1 |a Biltoft, Peter. 
700 1 |a Howard, Charles. 
700 1 |a Mack, Chris A. 
700 1 |a Graf, Michael. 
700 1 |a Zhang, Peng. 
700 1 |a Lai, Shouliang. 
700 1 |a Solzbacher, Florian. 
700 1 |a McInerney, Edward J. 
700 1 |a Ramdani, Jamal. 
700 1 |a Vaccari, Giovanni. 
700 1 |a Ritzdorf, Tom. 
700 1 |a Klocke, John. 
700 1 |a Dyer, Timothy S. 
700 1 |a Machamer, Andrew. 
700 1 |a Blair, Donald W. 
700 1 |a Arai, Kazuhisa. 
700 1 |a Kobayashi, Yoshikazu. 
700 1 |a Otani, Hideaki. 
700 1 |a Tonnies, Dietrich. 
700 1 |a Topper, Michael. 
700 1 |a Wang, Zhong L. 
700 1 |a Huff, Michael A. 
700 1 |a Liu, David N. 
700 1 |a Curcie, Wayne D. 
700 1 |a Sweeney, Joseph D. 
700 1 |a Cox, James C. 
700 1 |a Cavicchi, Kristin. 
700 1 |a Barsness, Dan. 
700 1 |a Gould, Charles K. 
700 1 |a Albrecht, David J. 
700 1 |a Li, Bo. 
700 1 |a Carriker, Wayne. 
700 1 |a Haris, Clint. 
700 1 |a Peltinov, Ram. 
700 1 |a Menaker, Mina. 
700 1 |a Scibilia, Bruno. 
700 1 |a Altis, Yoan Dupret. 
700 1 |a McCafferty, Robert H. 
700 1 |a Davis, Brett J. 
700 1 |a Trammell, Steven R. 
700 1 |a Pavlotsky, Richard V. 
700 1 |a Beck, Stephen C. 
700 1 |a Gendreau, Michael. 
700 1 |a Amick, Hal. 
700 1 |a Levit, Larry. 
700 1 |a Muller, Chris. 
700 1 |a Kochevar, Steven. 
700 1 |a Gromala, Jerry. 
700 1 |a Pinkowski, Richard E. 
710 2 |a IDC Corporation. 
740 0 2 |a How semiconductor chips are made. 
740 0 2 |a IC design. 
740 0 2 |a Silicon substrates for semiconductor manufacturing. 
740 0 2 |a Copper, low-k dielectrics, and their reliability. 
740 0 2 |a Fundamentals of silicide formation on Si. 
740 0 2 |a Plasma process control. 
740 0 2 |a Vacuum technology. 
740 0 2 |a Photomask. 
740 0 2 |a Microlithography. 
740 0 2 |a Ion implantation and rapid thermal processing. 
740 0 2 |a Wet etching. 
740 0 2 |a Plasma etching. 
740 0 2 |a Physical vapor deposition. 
740 0 2 |a Chemical vapor deposition. 
740 0 2 |a Epitaxy. 
740 0 2 |a ECD fundamentals. 
740 0 2 |a Chemical mechanical polishing. 
740 0 2 |a Wet cleaning. 
740 0 2 |a Inspection, measurement, and test. 
740 0 2 |a Grinding, stress relief, and dicing. 
740 0 2 |a Packaging. 
740 0 2 |a Nanotechnology and nanomanufacturing. 
740 0 2 |a Fundamentals of microelectromechanical systems. 
740 0 2 |a Flat-panel display technology and manufacturing. 
740 0 2 |a Specialty gas and CDA systems. 
740 0 2 |a Waste gas abatement systems. 
740 0 2 |a PFC abatement. 
740 0 2 |a Chemical and slurry handling systems. 
740 0 2 |a Fluid handling components for high-purity liquid chemicals and slurries. 
740 0 2 |a Fundamentals of ultrapure water. 
740 0 2 |a Yield management. 
740 0 2 |a Automated material handling system. 
740 0 2 |a CD metrology and CD-SEM. 
740 0 2 |a Six sigma. 
740 0 2 |a Advanced process control. 
740 0 2 |a Environmental, health, and safety considerations in semiconductor fabrication facilities. 
740 0 2 |a Plan, design, and construction of a fab. 
740 0 2 |a Cleanroom design and construction. 
740 0 2 |a Micro-vibration and noise design. 
740 0 2 |a ESD controls in cleanroom environments. 
740 0 2 |a Airborne molecular contamination. 
740 0 2 |a Particle monitoring in semiconductor manufacturing. 
740 0 2 |a Wastewater neutralization systems. 
776 0 |i Print version:   |t Semiconductor manufacturing handbook.  |b First edition.  |d New York, N.Y. : McGraw-Hill Education, 2005  |w (OCoLC)57638591 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071445597  |z Texto completo 
997 |a (c)2007 Cassidy Cataloguing Services, Inc.