Microvias : for low-cost, high-density interconnects /

Annotation.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Lau, John H. (Autor)
Otros Autores: Lee, S. W. Ricky
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2001]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Microelectronic packaging.
Multichip modules (Microelectronics)
Flip chip technology.
Printed circuits.
Drilling and boring.
Micro-drilling.
Microelectronics > Materials.
Solder and soldering.
Solder and soldering > Testing.
Microelectronics packaging > Reliability.
Multichip modules (Microelectronics) > Testing.
Integrated circuits > Design and construction > Cost control.
Semiconductors > Junctions.
Electronic books.
Acceso en línea:Texto completo

MARC

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010 |z  2001030752 
020 |a 0071455795 
020 |a 0071363270 (print-ISBN) 
020 |a 9780071363273 
035 |a (OCoLC)49851643 
040 |a IN-ChSCO  |b eng  |e rda 
041 0 |a eng 
050 4 |a TK7874 
082 0 4 |a 621.381/046  |2 21 
100 1 |a Lau, John H.,  |e author. 
245 1 0 |a Microvias : for low-cost, high-density interconnects /  |c John H. Lau, S.W. Ricky Lee. 
250 |a First edition. 
264 1 |a New York, N.Y. :  |b McGraw-Hill Education,  |c [2001] 
264 4 |c ?2001 
300 |a 1 online resource (xxiii, 565 pages) :  |b illustrations. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c2001. 
504 |a Includes bibliographical references and index. 
505 0 |a Ch. 1. Introduction to Microvia and WLCSP Technologies -- Ch. 2. Conventional Printed Circuit Board Technologies -- Ch. 3. Microvias by Mechanical Drilling -- Ch. 4. Microvias by Laser Drilling -- Ch. 5. Microvias by Photoimaging -- Ch. 6. Microvias by Etching -- Ch. 7. Conductive Paste/Ink-filled Microvias -- Ch. 8. Special High-Density Interconnects for Flip Chip Applications -- Ch. 9. Solders for Next-Generation High-Density Interconnects -- Ch. 10. Solder-Bumped Flip-Chip WLCSP -- Ch. 11. Assembly of Flip Chip on PCB/Substrate -- Ch. 12. Solder Joint Reliability of Flip Chip on Microvia PCB/Substrates. 
520 0 |a Annotation. 
530 |a Also available in print edition. 
533 |a Electronic reproduction.  |b New York, N.Y. :  |c McGraw Hill,   |d 2001.  |n Mode of access: World Wide Web.  |n System requirements: Web browser.  |n Access may be restricted to users at subscribing institutions. 
538 |a Mode of access: Internet via World Wide Web. 
545 0 |a Contributor biographical information:  |u http://www.loc.gov/catdir/bios/mh041/2001030752.html 
546 |a In English. 
588 |a Description based on cover image and table of contents, viewed on April 25, 2007. 
650 0 |a Microelectronic packaging. 
650 0 |a Multichip modules (Microelectronics) 
650 0 |a Flip chip technology. 
650 0 |a Printed circuits. 
650 0 |a Drilling and boring. 
650 0 |a Micro-drilling. 
650 0 |a Microelectronics  |x Materials. 
650 0 |a Solder and soldering. 
650 0 |a Solder and soldering  |x Testing. 
650 0 |a Microelectronics packaging  |x Reliability. 
650 0 |a Multichip modules (Microelectronics)  |x Testing. 
650 0 |a Integrated circuits  |x Design and construction  |x Cost control. 
650 0 |a Semiconductors  |x Junctions. 
655 0 |a Electronic books. 
700 1 |a Lee, S. W. Ricky. 
740 0 2 |a Introduction to microvia and WLCSP technologies. 
740 0 2 |a Conventional printed circuit board technologies. 
740 0 2 |a Microvias by mechanical drilling. 
740 0 2 |a Microvias by laser drilling. 
740 0 2 |a Microvias by photoimaging. 
740 0 2 |a Conductive paste/ink-filled microvias. 
740 0 2 |a Special high-density interconnects for flip chip applications. 
740 0 2 |a Solders for next-generation high-density interconnects. 
740 0 2 |a Solder-bumped flip chip WLCSP. 
740 0 2 |a Assembly of flip chip on PCB/substrate. 
740 0 2 |a Solder joint reliability of flip chip on microvia PCB/substrate. 
776 0 |i Print version:   |t Microvias : for low-cost, high-density interconnects.  |b First edition.  |d New York, N.Y. : McGraw-Hill Education, 2001  |w (OCoLC)46671171 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071363273  |z Texto completo 
997 |a (c)2007 Cassidy Cataloguing Services, Inc. 

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