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20070425182034.0 |
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070425s2004 nyua fobf 001 0 eng d |
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|z 2004040287
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| 020 |
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|a 0071450211
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| 020 |
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|z 0071432418 (print)
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| 020 |
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|a 9780071432412
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| 050 |
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4 |
|a TK7871.85
|b .V36 2004
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| 082 |
0 |
4 |
|a 621.3815/2
|2 22
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| 100 |
1 |
|
|a Van Zant, Peter.
|
| 245 |
1 |
0 |
|a Microchip fabrication : a practical guide to semiconductor processing
|h [electronic resource] /
|c Peter Van Zant.
|
| 250 |
|
|
|a 5th ed.
|
| 260 |
|
|
|a New York :
|b McGraw-Hill,
|c [2004]
|
| 300 |
|
|
|a 1 electronic text (xiii, 642 p.) :
|b ill.
|
| 490 |
1 |
|
|a McGraw-Hill's AccessEngineering
|
| 500 |
|
|
|a Print version c2004.
|
| 504 |
|
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|a Includes bibliographical references and index.
|
| 505 |
0 |
|
|u http://www.loc.gov/catdir/toc/mh051/2004040287.html
|
| 530 |
|
|
|a Also issued in print and PDF version.
|
| 545 |
0 |
|
|a Contributor biographical information:
|u http://www.loc.gov/catdir/bios/mh051/2004040287.html
|
| 588 |
|
|
|a Description based on cover image and table of contents, viewed on April 25, 2007.
|
| 650 |
|
0 |
|a Semiconductors
|x Design and construction.
|
| 650 |
|
0 |
|a Integrated circuits
|x Design and construction.
|
| 650 |
|
0 |
|a Semiconductor industry.
|
| 650 |
|
0 |
|a Semiconductors
|x Materials.
|
| 650 |
|
0 |
|a Chemicals.
|
| 650 |
|
0 |
|a Crystal growth.
|
| 650 |
|
0 |
|a Semiconductor wafers.
|
| 650 |
|
0 |
|a Semiconductors
|x Defects.
|
| 650 |
|
0 |
|a Contamination (Technology)
|
| 650 |
|
0 |
|a Industrial productivity.
|
| 650 |
|
0 |
|a Oxidation.
|
| 650 |
|
0 |
|a Microelectronics.
|
| 650 |
|
0 |
|a Microlithography.
|
| 650 |
|
0 |
|a Photolithography.
|
| 650 |
|
0 |
|a Semiconductor doping.
|
| 650 |
|
0 |
|a Semiconductor films.
|
| 650 |
|
0 |
|a Thin films.
|
| 650 |
|
0 |
|a Surfaces (Technology)
|
| 650 |
|
0 |
|a Metallizing.
|
| 650 |
|
0 |
|a Semiconductor waters
|x Design and construction.
|
| 650 |
|
0 |
|a Electronic packaging.
|
| 655 |
|
0 |
|a Electronic books.
|
| 655 |
|
0 |
|a Internet resources.
|
| 740 |
0 |
2 |
|a Semiconductor industry.
|
| 740 |
0 |
2 |
|a Properties of semiconductor materials and chemicals.
|
| 740 |
0 |
2 |
|a Crystal growth and silicon wafer preparation.
|
| 740 |
0 |
2 |
|a Overview of wafer fabrication.
|
| 740 |
0 |
2 |
|a Contamination control.
|
| 740 |
0 |
2 |
|a Productivity and process yields.
|
| 740 |
0 |
2 |
|a Oxidation.
|
| 740 |
0 |
2 |
|a Ten-step patterning process-surface preparation to exposure.
|
| 740 |
0 |
2 |
|a Ten-step patterning process-developing to final inspection.
|
| 740 |
0 |
2 |
|a Advanced photolithography processes.
|
| 740 |
0 |
2 |
|a Doping.
|
| 740 |
0 |
2 |
|a Layer deposition.
|
| 740 |
0 |
2 |
|a Metallization.
|
| 740 |
0 |
2 |
|a Process and device evaluation.
|
| 740 |
0 |
2 |
|a Business of wafer fabrication.
|
| 740 |
0 |
2 |
|a Introduction to devices and integrated circuit formation.
|
| 740 |
0 |
2 |
|a Introduction to integrated circuits.
|
| 740 |
0 |
2 |
|a Packaging.
|
| 830 |
|
0 |
|a McGraw-Hill's AccessEngineering.
|
| 856 |
4 |
0 |
|u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071432412
|z Texto completo
|
| 997 |
|
|
|a (c)2007 Cassidy Cataloguing Services, Inc.
|
