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008 070425s2004 nyua fobf 001 0 eng d
010 |z  2004040287 
020 |a 0071450211 
020 |z 0071432418 (print) 
020 |a 9780071432412 
050 4 |a TK7871.85  |b .V36 2004 
082 0 4 |a 621.3815/2  |2 22 
100 1 |a Van Zant, Peter. 
245 1 0 |a Microchip fabrication : a practical guide to semiconductor processing  |h [electronic resource] /  |c Peter Van Zant. 
250 |a 5th ed. 
260 |a New York :  |b McGraw-Hill,  |c [2004] 
300 |a 1 electronic text (xiii, 642 p.) :  |b ill. 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c2004. 
504 |a Includes bibliographical references and index. 
505 0 |u http://www.loc.gov/catdir/toc/mh051/2004040287.html 
530 |a Also issued in print and PDF version. 
545 0 |a Contributor biographical information:  |u http://www.loc.gov/catdir/bios/mh051/2004040287.html 
588 |a Description based on cover image and table of contents, viewed on April 25, 2007. 
650 0 |a Semiconductors  |x Design and construction. 
650 0 |a Integrated circuits  |x Design and construction. 
650 0 |a Semiconductor industry. 
650 0 |a Semiconductors  |x Materials. 
650 0 |a Chemicals. 
650 0 |a Crystal growth. 
650 0 |a Semiconductor wafers. 
650 0 |a Semiconductors  |x Defects. 
650 0 |a Contamination (Technology) 
650 0 |a Industrial productivity. 
650 0 |a Oxidation. 
650 0 |a Microelectronics. 
650 0 |a Microlithography. 
650 0 |a Photolithography. 
650 0 |a Semiconductor doping. 
650 0 |a Semiconductor films. 
650 0 |a Thin films. 
650 0 |a Surfaces (Technology) 
650 0 |a Metallizing. 
650 0 |a Semiconductor waters  |x Design and construction. 
650 0 |a Electronic packaging. 
655 0 |a Electronic books. 
655 0 |a Internet resources. 
740 0 2 |a Semiconductor industry. 
740 0 2 |a Properties of semiconductor materials and chemicals. 
740 0 2 |a Crystal growth and silicon wafer preparation. 
740 0 2 |a Overview of wafer fabrication. 
740 0 2 |a Contamination control. 
740 0 2 |a Productivity and process yields. 
740 0 2 |a Oxidation. 
740 0 2 |a Ten-step patterning process-surface preparation to exposure. 
740 0 2 |a Ten-step patterning process-developing to final inspection. 
740 0 2 |a Advanced photolithography processes. 
740 0 2 |a Doping. 
740 0 2 |a Layer deposition. 
740 0 2 |a Metallization. 
740 0 2 |a Process and device evaluation. 
740 0 2 |a Business of wafer fabrication. 
740 0 2 |a Introduction to devices and integrated circuit formation. 
740 0 2 |a Introduction to integrated circuits. 
740 0 2 |a Packaging. 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071432412  |z Texto completo 
997 |a (c)2007 Cassidy Cataloguing Services, Inc.