Fundamentals of microsystems packaging /

"A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter.".

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Tummala, Rao R., 1942-, Morris, James E., Davidson, Evan, Sarma, D. H. R., Hubbard, Bob, Rao, N. J., Swaminathan, Madhavan, Peterson, Andrew F., Kim, Juongho, Sitaraman, Suresh K., Pang, John H. L., Bar-Cohen, Avram, Watwe, Abhay, Seetharamu, Kankanhally N., Kamath, Sundar M., Charles, Harry K., Baldwin, David F., Garrou, Phil, Prymak, John, Bhattacharya, Swapan, Paik, Kyung, Cruz Rivera, Jose L., Gaylord, Thomas K., Glytsis, Elias N., Laskar, Joy, Tentzeris, Emmanouil M., Schutt-Aine, Jose E., Ramesham, Rajeshuni, Ghaffarian, Reza, Ayazi, Farrokh, Wong, C. P., Fang, Treliant, Varadarajan, Mahesh, Illyefalvi-Vitez, Zsolt, ZImmermann, Joachim, Mattsson, Fredrik, Kandelid, Stefan, Raj, Pulugurtha Markondeya, Liu, Johan, Ohlckers, Per, Keezer, David, Kim, Bruce, Koppolu, Sasidhar, May, Gary S., Shinotani, Ken-ichi, Malmodin, Jens, Trankell, Richard, Qu, Jianmin, Guo, Yifan
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2001]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Electronic packaging.
Microelectronic packaging.
Miniature electronic equipment > Packaging.
Electronic packaging > Design.
Electronic apparatus and appliances > Temperature control.
Chip scale packaging.
Multichip modules (Microelectonics)
Integrated circuits.
Integrated circuits industry.
Passive components.
Integrated passive components.
Optoelectronics.
Radio frequency integrated circuits.
Microelectromechanical systems.
Sealing (Technology)
Miniature electronic equipment (Bonding)
Electronic apparatus and appliances > Plastic embedment.
Electronics > Materials > Surfaces.
Semiconductors > Surfaces.
Printed circuits > Design and construction.
Surface mount technology.
Electronic packaging > Materials.
Microelectronic packaging > Materials.
Electronics > Testing.
Microelectronics > Testing.
Microelectronics > Design.
Electronic apparatus and appliances > Reliability.
Electronic books.
Acceso en línea:Texto completo

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