Fundamentals of microsystems packaging /

"A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter.".

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Tummala, Rao R., 1942-, Morris, James E., Davidson, Evan, Sarma, D. H. R., Hubbard, Bob, Rao, N. J., Swaminathan, Madhavan, Peterson, Andrew F., Kim, Juongho, Sitaraman, Suresh K., Pang, John H. L., Bar-Cohen, Avram, Watwe, Abhay, Seetharamu, Kankanhally N., Kamath, Sundar M., Charles, Harry K., Baldwin, David F., Garrou, Phil, Prymak, John, Bhattacharya, Swapan, Paik, Kyung, Cruz Rivera, Jose L., Gaylord, Thomas K., Glytsis, Elias N., Laskar, Joy, Tentzeris, Emmanouil M., Schutt-Aine, Jose E., Ramesham, Rajeshuni, Ghaffarian, Reza, Ayazi, Farrokh, Wong, C. P., Fang, Treliant, Varadarajan, Mahesh, Illyefalvi-Vitez, Zsolt, ZImmermann, Joachim, Mattsson, Fredrik, Kandelid, Stefan, Raj, Pulugurtha Markondeya, Liu, Johan, Ohlckers, Per, Keezer, David, Kim, Bruce, Koppolu, Sasidhar, May, Gary S., Shinotani, Ken-ichi, Malmodin, Jens, Trankell, Richard, Qu, Jianmin, Guo, Yifan
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2001]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Electronic packaging.
Microelectronic packaging.
Miniature electronic equipment > Packaging.
Electronic packaging > Design.
Electronic apparatus and appliances > Temperature control.
Chip scale packaging.
Multichip modules (Microelectonics)
Integrated circuits.
Integrated circuits industry.
Passive components.
Integrated passive components.
Optoelectronics.
Radio frequency integrated circuits.
Microelectromechanical systems.
Sealing (Technology)
Miniature electronic equipment (Bonding)
Electronic apparatus and appliances > Plastic embedment.
Electronics > Materials > Surfaces.
Semiconductors > Surfaces.
Printed circuits > Design and construction.
Surface mount technology.
Electronic packaging > Materials.
Microelectronic packaging > Materials.
Electronics > Testing.
Microelectronics > Testing.
Microelectronics > Design.
Electronic apparatus and appliances > Reliability.
Electronic books.
Acceso en línea:Texto completo

MARC

LEADER 00000nam a2200000 i 4500
001 MGH_AEccn00213593
003 IN-ChSCO
005 20210416124538.0
006 m|||||||||||||||||
007 cr |n||||||||n
008 210416s2001||||nyu|||||o|||||||||||eng||
010 |z  2001273178 
020 |a 0071371699 (print-ISBN) 
020 |a 0071450033 
020 |a 9780071371698 
035 |a (OCoLC)51008040 
040 |a IN-ChSCO  |b eng  |e rda 
041 0 |a eng 
050 4 |a TK7870.15 
082 0 4 |a 621.381/046  |2 22 
245 0 0 |a Fundamentals of microsystems packaging /  |c edited by Rao R. Tummala. 
250 |a First edition. 
264 1 |a New York, N.Y. :  |b McGraw-Hill Education,  |c [2001] 
264 4 |c ?2001 
300 |a 1 online resource (vii, 967 pages) :  |b illustrations. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c2001. 
504 |a Includes bibliographical references and index. 
505 0 |a Introduction to microsystems packaging -- Role of packaging in microelectronics -- Role of packaging in microsystems -- Fundamentals of electrical package design -- Fundamentals of design for reliability -- Fundamentals of thermal management -- Fundamentals of single chip packaging -- Fundamentals of multichip packaging -- Fundamentals of IC assembly -- Fundamentals of wafer-level packaging -- Fundamentals of passives: discrete, integrated, and embedded -- Fundamentals of optoelectronics -- Fundamentals of RF packaging -- Fundamentals of microelectromechanical systems -- Fundamentals of sealing and encapsulation -- Fundamentals of system-level PWB technologies -- Fundamentals of board assembly -- Fundamentals of packaging materials and processes -- Fundamentals of electrical testing -- Fundamentals of packaging manufacturing -- Fundamentals of microsystems design for environment -- Fundamentals of microsystems reliability. 
520 0 |a "A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter.". 
530 |a Also available in print edition. 
533 |a Electronic reproduction.  |b New York, N.Y. :  |c McGraw Hill,   |d 2001.  |n Mode of access: World Wide Web.  |n System requirements: Web browser.  |n Access may be restricted to users at subscribing institutions. 
538 |a Mode of access: Internet via World Wide Web. 
545 0 |a Contributor biographical information:  |u http://www.loc.gov/catdir/bios/mh041/2001273178.html 
546 |a In English. 
588 |a Description based on cover image and table of contents, viewed on April 26, 2007. 
650 0 |a Electronic packaging. 
650 0 |a Microelectronic packaging. 
650 0 |a Miniature electronic equipment  |x Packaging. 
650 0 |a Electronic packaging  |x Design. 
650 0 |a Electronic apparatus and appliances  |x Temperature control. 
650 0 |a Chip scale packaging. 
650 0 |a Multichip modules (Microelectonics) 
650 0 |a Integrated circuits. 
650 0 |a Integrated circuits industry. 
650 0 |a Passive components. 
650 0 |a Integrated passive components. 
650 0 |a Optoelectronics. 
650 0 |a Radio frequency integrated circuits. 
650 0 |a Microelectromechanical systems. 
650 0 |a Sealing (Technology) 
650 0 |a Miniature electronic equipment (Bonding) 
650 0 |a Electronic apparatus and appliances  |x Plastic embedment. 
650 0 |a Electronics  |x Materials  |x Surfaces. 
650 0 |a Semiconductors  |x Surfaces. 
650 0 |a Printed circuits  |x Design and construction. 
650 0 |a Surface mount technology. 
650 0 |a Electronic packaging  |x Materials. 
650 0 |a Microelectronic packaging  |x Materials. 
650 0 |a Electronics  |x Testing. 
650 0 |a Microelectronics  |x Testing. 
650 0 |a Microelectronics  |x Design. 
650 0 |a Electronic apparatus and appliances  |x Reliability. 
655 0 |a Electronic books. 
700 1 |a Tummala, Rao R.,  |d 1942- 
700 1 |a Morris, James E. 
700 1 |a Davidson, Evan. 
700 1 |a Sarma, D. H. R. 
700 1 |a Hubbard, Bob. 
700 1 |a Rao, N. J. 
700 1 |a Swaminathan, Madhavan. 
700 1 |a Peterson, Andrew F. 
700 1 |a Kim, Juongho. 
700 1 |a Sitaraman, Suresh K. 
700 1 |a Pang, John H. L. 
700 1 |a Bar-Cohen, Avram. 
700 1 |a Watwe, Abhay. 
700 1 |a Seetharamu, Kankanhally N. 
700 1 |a Kamath, Sundar M. 
700 1 |a Charles, Harry K. 
700 1 |a Baldwin, David F. 
700 1 |a Garrou, Phil. 
700 1 |a Prymak, John. 
700 1 |a Bhattacharya, Swapan. 
700 1 |a Paik, Kyung. 
700 1 |a Cruz Rivera, Jose L. 
700 1 |a Gaylord, Thomas K. 
700 1 |a Glytsis, Elias N. 
700 1 |a Laskar, Joy. 
700 1 |a Tentzeris, Emmanouil M. 
700 1 |a Schutt-Aine, Jose E. 
700 1 |a Ramesham, Rajeshuni. 
700 1 |a Ghaffarian, Reza. 
700 1 |a Ayazi, Farrokh. 
700 1 |a Wong, C. P. 
700 1 |a Fang, Treliant. 
700 1 |a Varadarajan, Mahesh. 
700 1 |a Illyefalvi-Vitez, Zsolt. 
700 1 |a ZImmermann, Joachim. 
700 1 |a Mattsson, Fredrik. 
700 1 |a Kandelid, Stefan. 
700 1 |a Raj, Pulugurtha Markondeya. 
700 1 |a Liu, Johan. 
700 1 |a Ohlckers, Per. 
700 1 |a Keezer, David. 
700 1 |a Kim, Bruce. 
700 1 |a Koppolu, Sasidhar. 
700 1 |a May, Gary S. 
700 1 |a Shinotani, Ken-ichi. 
700 1 |a Malmodin, Jens. 
700 1 |a Trankell, Richard. 
700 1 |a Qu, Jianmin. 
700 1 |a Guo, Yifan. 
740 0 2 |a Introduction to microsystems packaging. 
740 0 2 |a Role of packaging in microelectronics. 
740 0 2 |a Role of packaging in microsystems. 
740 0 2 |a Fundamentals of electrical package design. 
740 0 2 |a Fundamentals of design for reliability. 
740 0 2 |a Fundamentals of thermal management. 
740 0 2 |a Fundamentals of single chip packaging. 
740 0 2 |a Fundamentals of multichip packaging. 
740 0 2 |a Fundamentals of IC assembly. 
740 0 2 |a Fundamentals of wafer-level packaging. 
740 0 2 |a Fundamentals of passives : discrete, integrated, and embedded. 
740 0 2 |a Fundamentals of optoelectronics. 
740 0 2 |a Fundamentals of RF packaging. 
740 0 2 |a Fundamentals of microelectromechanical systems. 
740 0 2 |a Fundamentals of sealing and encapsulation. 
740 0 2 |a Fundamentals of system-level PWB technologies. 
740 0 2 |a Fundamentals of board assembly. 
740 0 2 |a Fundamentals of packaging materials and processes. 
740 0 2 |a Fundamentals of electrical testing. 
740 0 2 |a Fundamentals of package manufacturing. 
740 0 2 |a Fundamentals of microsystems design for environment. 
740 0 2 |a Fundamentals of microsystems reliability. 
776 0 |i Print version:   |t Fundamentals of microsystems packaging.  |b First edition.  |d New York, N.Y. : McGraw-Hill Education, 2001  |w (OCoLC)47263629 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071371698  |z Texto completo 
997 |a (c)2007 Cassidy Cataloguing Services, Inc. 

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