Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials /

"This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Lau, John H.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2003]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Electronic apparatus and appliances > Design and construction.
Green products.
Environmental protection.
Electronic apparatus and appliances > Materials > Environmental aspects.
Electronic packaging > Materials > Environmental aspects.
Microelectronic packaging > Materials > Environmental aspects.
Integrated circuits > Materials > Environmental aspects.
Polychlorinated biphenals > Environmental aspects.
Solders and soldering > Environmental aspects.
Halocarbons > Environmental aspects.
Lead-free electronics manufacturing processes.
Adhesives > Environmental aspects.
Electronics > Materials > Environmental aspects.
Electronic books.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Introduction to Environmentally Benign Electronics Manufacturing
  • Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps
  • WLCSP with Lead-Free Solder Bumps on PCB/Substrate
  • Chip (Wafer)-Level Interconnects with Solderless Bumps
  • WLCSP with Solderless Bumps on PCB/Substrate
  • Environmentally Benign Molding Compounds for IC Packages
  • Environmentally Benign Die Attach Films for IC Packaging
  • Environmental Issues for Conventional PCBs
  • Halogenated and Halogen-Free Materials for Flame Retardation
  • Fabrication of Environmentally Friendly PCB
  • Global Status of Lead-Free Soldering
  • Development of Lead-Free Solder Alloys
  • Prevailing Lead-Free Alloys
  • Lead-Free Surface Finishes
  • Implementation of Lead-Free Soldering
  • Challenges for Lead-Free Soldering
  • Introduction to Conductive Adhesives
  • Conductivity Establishment of Conductive Adhesives
  • Mechanisms Underlying the Unstable Contact Resistance of ECAs
  • Stabilization of Contact Resistance of Conductive Adhesives
  • Index
  • About the Author.

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