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Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials /
"This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2003]
|
| Edición: | First edition. |
| Colección: | McGraw-Hill's AccessEngineering.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 010 | |z 2002028803 | ||
| 020 | |a 0071386246 (print-ISBN) | ||
| 020 | |a 007145005X | ||
| 020 | |a 9780071386241 | ||
| 035 | |a (OCoLC)236338340 | ||
| 040 | |a IN-ChSCO |b eng |e rda | ||
| 041 | 0 | |a eng | |
| 050 | 4 | |a TK7836 | |
| 082 | 0 | 4 | |a 621.381 |2 21 |
| 245 | 0 | 0 | |a Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials / |c John H. Lau . [et al.]. |
| 250 | |a First edition. | ||
| 264 | 1 | |a New York, N.Y. : |b McGraw-Hill Education, |c [2003] | |
| 264 | 4 | |c ?2003 | |
| 300 | |a 1 online resource (700 pages) : |b illustrations. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a computer |2 rdamedia | ||
| 338 | |a online resource |2 rdacarrier | ||
| 490 | 1 | |a McGraw-Hill's AccessEngineering | |
| 500 | |a Print version c2003. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Introduction to Environmentally Benign Electronics Manufacturing -- Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps -- WLCSP with Lead-Free Solder Bumps on PCB/Substrate -- Chip (Wafer)-Level Interconnects with Solderless Bumps -- WLCSP with Solderless Bumps on PCB/Substrate -- Environmentally Benign Molding Compounds for IC Packages -- Environmentally Benign Die Attach Films for IC Packaging -- Environmental Issues for Conventional PCBs -- Halogenated and Halogen-Free Materials for Flame Retardation -- Fabrication of Environmentally Friendly PCB -- Global Status of Lead-Free Soldering -- Development of Lead-Free Solder Alloys -- Prevailing Lead-Free Alloys -- Lead-Free Surface Finishes -- Implementation of Lead-Free Soldering -- Challenges for Lead-Free Soldering -- Introduction to Conductive Adhesives -- Conductivity Establishment of Conductive Adhesives -- Mechanisms Underlying the Unstable Contact Resistance of ECAs -- Stabilization of Contact Resistance of Conductive Adhesives -- Index -- About the Author. | |
| 520 | 0 | |a "This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: chip (wafer) level interconnects with lead-free solder bumps; lead-free solder wafer bumping with micro-ball mounting and paste printing methods; lead-free solder joint reliability of WLCSPs on organic and ceramic substrates; chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs; design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate; halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages; environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging; environmental issues for conventional PCBs and substrates; some environmentally conscious flame-retardants for PCBs and organic substrates; emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety. It also includes the topics: lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives; criteria, development approaches, and varieties of alloys and properties of lead-free solders; physical, mechanical, chemical, electrical, and soldering properties of lead-free solders; manufacturing process and performance of lead-free surface finishes for both PCB and component applications; implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process; fundamental understanding of electrically conductive adhesive (ECA) technology; effects of lubricant removal and cure shrinkage on ECAs; mechanisms underlying the contact resistance shifts of ECAs; effects of electrolytes and moisture absorption on contact resistance shifts of ECAs; and stabilization of contact resistance of ECAs using various additives.". | |
| 530 | |a Also available in print edition. | ||
| 533 | |a Electronic reproduction. |b New York, N.Y. : |c McGraw Hill, |d 2003. |n Mode of access: World Wide Web. |n System requirements: Web browser. |n Access may be restricted to users at subscribing institutions. | ||
| 538 | |a Mode of access: Internet via World Wide Web. | ||
| 545 | 0 | |a Contributor biographical information: |u http://www.loc.gov/catdir/bios/mh041/2002028803.html | |
| 546 | |a In English. | ||
| 588 | |a Description based on cover image and table of contents, viewed on April 24, 2007. | ||
| 650 | 0 | |a Electronic apparatus and appliances |x Design and construction. | |
| 650 | 0 | |a Green products. | |
| 650 | 0 | |a Environmental protection. | |
| 650 | 0 | |a Electronic apparatus and appliances |x Materials |x Environmental aspects. | |
| 650 | 0 | |a Electronic packaging |x Materials |x Environmental aspects. | |
| 650 | 0 | |a Microelectronic packaging |x Materials |x Environmental aspects. | |
| 650 | 0 | |a Integrated circuits |x Materials |x Environmental aspects. | |
| 650 | 0 | |a Polychlorinated biphenals |x Environmental aspects. | |
| 650 | 0 | |a Solders and soldering |x Environmental aspects. | |
| 650 | 0 | |a Halocarbons |x Environmental aspects. | |
| 650 | 0 | |a Lead-free electronics manufacturing processes. | |
| 650 | 0 | |a Adhesives |x Environmental aspects. | |
| 650 | 0 | |a Electronics |x Materials |x Environmental aspects. | |
| 655 | 0 | |a Electronic books. | |
| 700 | 1 | |a Lau, John H. | |
| 740 | 0 | 2 | |a Introduction to environmentally benign electronics manufacturing. |
| 740 | 0 | 2 | |a Chip- (wafer- ) level interconnects with lead-free solder bumps. |
| 740 | 0 | 2 | |a WLCSP with lead-free solder bumps on PCB/substrate. |
| 740 | 0 | 2 | |a Chip- (wafer- ) level interconnects with solderless bumps. |
| 740 | 0 | 2 | |a WLCSPs with solderless bumps on PCB/substate. |
| 740 | 0 | 2 | |a Environmentally benign molding compounds for IC packages. |
| 740 | 0 | 2 | |a Environmentally benign die attach films for IC packaging. |
| 740 | 0 | 2 | |a Environmental issues for conventional PCBs. |
| 740 | 0 | 2 | |a Halogenated and halogen-free materials for flame retardation. |
| 740 | 0 | 2 | |a Fabrication of environmentally friendly PCB. |
| 740 | 0 | 2 | |a Global status of lead-free soldering. |
| 740 | 0 | 2 | |a Development of lead-free solder alloys. |
| 740 | 0 | 2 | |a Prevailing lead-free alloys. |
| 740 | 0 | 2 | |a Lead-free surface finishes. |
| 740 | 0 | 2 | |a Implementation of lead-free soldering. |
| 740 | 0 | 2 | |a Challenges for lead-free soldering. |
| 740 | 0 | 2 | |a Introduction to conducive adhesives. |
| 740 | 0 | 2 | |a Conductivity establishment of conductive adhesives. |
| 740 | 0 | 2 | |a Mechanisms underlying the unstable contact resistance of ECAs. |
| 740 | 0 | 2 | |a Stabilization of contact resistance of conductive adhesives. |
| 776 | 0 | |i Print version: |t Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials. |b First edition. |d New York, N.Y. : McGraw-Hill Education, 2003 |w (OCoLC)50184901 | |
| 830 | 0 | |a McGraw-Hill's AccessEngineering. | |
| 856 | 4 | 0 | |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071386241 |z Texto completo |
| 997 | |a (c)2007 Cassidy Cataloguing Services, Inc. | ||