Electronic materials and processes handbook

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Harper, Charles A., Cohn, Charles, Schoch, Karl F., Bailey, Alan E., Gardner, J. Donald, Hwang, Jennie S., McChesney, Mike, Carano, Michael, Fjelstad, Joseph, Sergent, Jerry E., Toleno, Brian J., Burns, Barry, Marinelli, Christy, Krum, Al
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York : McGraw-Hill, [2003]
Edición:3rd ed.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Electronics > Materials.
Electronic apparatus and appliances > Materials.
Integrated circuits > Design and construction.
Microelectronics.
Integrated circuits > Materials.
Electronic ceramics.
Electronic packaging.
Microelectronic packaging.
Printed circuits.
Electric insulators and insulation > Plastics.
Adhesives.
Solder and soldering.
Electronic apparatus and appliances > Temperature control.
Electronic books.
Internet resources.
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000 a 4500
001 MGH_AEccn00213578
005 20070424182034.0
006 m f d
007 cr cn ---uuauu
008 070424s2003 nyua fobf 001 0 eng d
010 |z  2003046353 
020 |z 0071402144 (print) 
020 |a 0071450297 
020 |a 9780071402149 
050 4 |a TK7836  |b .E4654 2003 
082 0 4 |a 621.381  |2 21 
245 0 0 |a Electronic materials and processes handbook  |h [electronic resource] /  |c Charles A. Harper, editor in chief. 
250 |a 3rd ed. 
260 |a New York :  |b McGraw-Hill,  |c [2003] 
300 |a 1 electronic text :  |b ill. 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c2003. 
504 |a Includes bibliographical references and index. 
505 0 |u http://www.loc.gov/catdir/toc/mh031/2003046353.html 
530 |a Also issued in print and PDF version. 
545 0 |a Contributor biographical information:  |u http://www.loc.gov/catdir/bios/mh041/2003046353.html 
588 |a Description based on cover image and table of contents, viewed on April 24, 2007. 
650 0 |a Electronics  |x Materials. 
650 0 |a Electronic apparatus and appliances  |x Materials. 
650 0 |a Integrated circuits  |x Design and construction. 
650 0 |a Microelectronics. 
650 0 |a Integrated circuits  |x Materials. 
650 0 |a Electronic ceramics. 
650 0 |a Electronic packaging. 
650 0 |a Microelectronic packaging. 
650 0 |a Printed circuits. 
650 0 |a Electric insulators and insulation  |x Plastics. 
650 0 |a Adhesives. 
650 0 |a Solder and soldering. 
650 0 |a Electronic apparatus and appliances  |x Temperature control. 
655 0 |a Electronic books. 
655 0 |a Internet resources. 
700 1 |a Harper, Charles A. 
700 1 |a Cohn, Charles. 
700 1 |a Schoch, Karl F. 
700 1 |a Bailey, Alan E. 
700 1 |a Gardner, J. Donald. 
700 1 |a Hwang, Jennie S. 
700 1 |a McChesney, Mike. 
700 1 |a Carano, Michael. 
700 1 |a Fjelstad, Joseph. 
700 1 |a Sergent, Jerry E. 
700 1 |a Toleno, Brian J. 
700 1 |a Burns, Barry. 
700 1 |a Marinelli, Christy. 
700 1 |a Krum, Al. 
740 0 2 |a Development and fabrication of IC chips. 
740 0 2 |a Plastics, elastomers, and composites. 
740 0 2 |a Ceramics and glasses. 
740 0 2 |a Metals. 
740 0 2 |a Solder technologies for electronic packaging and assembly. 
740 0 2 |a Electroplating and deposited metallic coatings. 
740 0 2 |a Printed circuit board fabrication. 
740 0 2 |a Materials and processes for hybrid microelectronics and multichip modules. 
740 0 2 |a Adhesives, underfills, and coatings in electonics assemblies. 
740 0 2 |a Thermal management materials and systems. 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071402149  |z Texto completo 
997 |a (c)2007 Cassidy Cataloguing Services, Inc. 

Ejemplares similares